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Suggested Items

The Missing Connection: Wire Harness Quoting Joins the Digital Age

05/01/2026 | Joanne Harris, Tech-2marketing
Walk the floor of a modern wire harness manufacturing facility, and the investment in technology is hard to miss. Automated wire cutting and stripping machines process thousands of cuts an hour with sub-millimeter precision. Computerized crimping presses deliver consistent, validated terminations that a hand tool never could. Laser wire markers, automated test benches, and vision-guided assembly stations represent hundreds of thousands of dollars of capital investment, all in service of building a better harness faster and more reliably than the competition.

Everspin Executes $40M Agreement for Mil-Aero MRAM Applications

05/01/2026 | Everspin Technologies, Inc.
Everspin Technologies, Inc., the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, announced an agreement with a U.S. prime contractor to provide state-of-the-art Toggle MRAM process technology capabilities and engineering services for United States Defense Industrial Base customers.

Everspin Executes $40M Agreement for Mil-Aero MRAM Applications

04/30/2026 | Everspin Technologies, Inc.
Everspin Technologies, Inc., the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, announced an agreement with a U.S. prime contractor to provide state-of-the-art Toggle MRAM process technology capabilities and engineering services for United States Defense Industrial Base customers.

Swinburne University, Siemens Launch Australia’s First Quantum Timing Study for Smarter Power Grids

04/30/2026 | Siemens
Swinburne University of Technology and Siemens are undertaking first-of-its-kind research in Australia, into how quantum-enhanced timing can help future-proof the energy grid and increase grid stability.

A Designer's Focus on High Density

04/30/2026 | Marcy LaRont, I-Connect007 Magazine
Vern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.
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