Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

SIA Applauds CHIPS R&D Awards to Advance U.S. Leadership in Quantum Computing

05/22/2026 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending several research awards announced today by the CHIPS Research and Development Office (CRDO) to advance quantum computing technology.

IBM, U.S. Department of Commerce Announce America's First Quantum Foundry with $1B CHIPS Award

05/21/2026 | PRNewswire
IBM and the U.S. Department of Commerce (DoC) announced a Letter of Intent (LOI) to build an American quantum chip foundry, securing the nation's global quantum leadership and fueling the country's growing quantum ecosystem.

imec Unveils World-First Quantum Dot Qubit Device Using High-NA EUV Lithography

05/20/2026 | Imec
This week, at ITF World, imec, a world-leading research and innovation hub in advanced semiconductor technologies, presents a world first: a quantum dot qubit device fabricated using High NA EUV lithography.

Casimir Launches With $12M Seed Round for Quantum Energy Chip

05/12/2026 | BUSINESS WIRE
Casimir, Inc., a quantum energy technology company founded by former NASA advanced propulsion researcher Dr. Harold “Sonny” White, today announced the close of a $12 million seed round led by Scout Ventures.

Xanadu, EV Group Partner to Build Industrial-Scale Photonic Quantum Hardware

05/05/2026 | PRNewswire
Xanadu Quantum Technologies Ltd., a leading photonic quantum computing company, and EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, announced a strategic partnership to develop critical heterogeneous integration and wafer bonding processes to facilitate the scalability of photonic quantum systems.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in