Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

Below the Surface: From Substrate to System—Why Integration Is the Real RF Breakthrough

10/14/2026 | Chandra Gupta -- Column: Below the Surface
In previous columns, I’ve described the ceramic substrate itself, talking about why material choice matters so deeply in electronics, RF, microwave, and millimeter-wave applications. Dielectric constant, loss tangent, thermal conductivity, and stability across temperature and frequency are the physical rules that govern whether a signal arrives intact or collapses into noise. But focusing only on the substrate is a bit like judging a city solely by its geology. Bedrock matters, of course.

Qnity Expands Thermal Management Solutions for AI Memory Cooling

10/13/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced two new advanced memory cooling solutions leveraging Laird™ Graphite-over-Foam (GOF) and Laird™ Thermal Interface Material (TIM) technologies.

Aismalibar to Showcase Advanced Thermal Management Materials at The Battery Show North America 2026

10/07/2026 | Aismalibar
Aismalibar, a global leader in advanced thermal management materials for electronics and high-power applications, will exhibit at The Battery Show North America 2026, taking place October 12–15 at Huntington Place in Detroit, Michigan.

Qnity Introduces High-Temperature Sealing Solution for Semiconductor Manufacturing

10/06/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced Kalrez® 7080 perfluoroelastomer parts, a high-performance sealing solution engineered for semiconductor processes operating at temperatures up to 330°C.

Indium, SMT Thermal Tech to Demonstrate Low-Temp Reflow Energy Savings

10/05/2026 | Indium Corporation
Indium Corporation® Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will explore how combining innovative solder materials with optimized reflow oven technology can reduce energy consumption at the Expo for Electronics Manufacturing (EFX), October 6-8, in Stuttgart, Germany.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in