Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Turn Inspiration into Innovation through IPC APEX EXPO 2017 Educational Programs
November 16, 2016 | IPCEstimated reading time: 2 minutes
The latest technical research, industry best practices, trending topics, ground-breaking technologies and forward thinking innovations will take center stage throughout the IPC APEX EXPO 2017 technical conference and professional development courses, which will take place February 11–16 at the San Diego Convention Center in San Diego, California. Registration is now open here.
In keeping with the event’s theme, “Technology’s Turning Point,” the technical conference will feature approximately 90 technical papers detailing original research and innovations from industry experts around the world. Subject-matter experts will cover topics in the areas of board fabrication and design, electronics assembly and test.
Attendees wanting to learn more about best practices in design, lead-free technologies, materials, process improvement, solder joint reliability, PCB fabrication and materials, quality and reliability and more, can choose from 34 professional development courses that go beyond theory to address real-world problems and provide practical solutions that could be implemented immediately for real-world success.
“Our technical conference is at the heart of technology's turning point. The content, including the latest original research, will set the stage for the electronics industry innovation that will turn our industry toward the future,” said IPC Technical Conference Director Jasbir Bath. He adds, “Our wide-ranging educational program features a variety of learning opportunities where attendees can access the latest research and development in the industry and learn more about trending materials, applications and processes such as printed electronics. Attendees can take everything they learn back to their company and put it all to work.”
In addition, IPC APEX EXPO features many free activities, including technical BUZZ sessions, poster presentations, keynotes on “The Big Bang Theory - Making Science Cool (and Funny)” by actress, author and neuroscientist Mayim Bialik and “The Future of Drones” by Naval officer, military pilot and Duke University professor, Mary Cummings. The highly popular New Products Corridor and the new Printed Electronics Pavilion will be featured along with more than 450 of the industry’s top suppliers.
Access to the exhibit hall is free to those who register in advance, a savings of $40 on-site. Attendees who register by January 12, 2017, will save 20 percent off registration fees. In addition, attendees who register for the All-Access Package will save a significant percentage off a la carte options.
More information about IPC APEX EXPO 2017, including details on education and technology, network opportunities, show floor activities, schedule, travel and more is available here.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,800 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.