Molex Solder on Polyester Substrate Delivers Flexible, Cost-effective Circuitry
November 17, 2016 | Business WireEstimated reading time: 1 minute
Molex has introduced Solder on Polyester Substrate, a flexible, economical alternative to rigid PCB and polyimide. Surface mount (SMT) components, including fine-pitched integrated circuits (ICs) are attached with low-temperature solder and encapsulated on a polyester substrate. Custom designed products can be used for capacitive touch buttons, capacitive fluid level sensors and membrane switches in a broad range of consumer, medical and industrial applications.
“The ability to bond fine-pitch ICs to polyester film using traditional SMT processes can free up real estate on the controller PCB,” said Steve Fulton, engineering manager, Molex. “Before Molex developed this flexible circuit solution, ICs couldn’t be soldered to PET because the high-temperature process would damage the polyester. The alternative, conductive epoxy, can cause short circuits between closely spaced contacts, limiting component sizes and packages.”
By allowing smaller components with tighter pitches, the Solder on Polyester Substrate delivers higher yields and reduces costs. To ensure a robust connection, solder joints are protected by UV-cured encapsulant, enabling them to withstand vibration and mechanical shock. In addition, right-angle LEDs can be attached to enhance backlighting for user-interface applications. The flexible substrate is available in clear, translucent or white. Typical thicknesses are 0.13 and 0.18mm.
About Molex
Molex brings together innovation and technology to deliver electronic solutions to customers worldwide. With a presence in more than 40 countries, Molex offers a full suite of solutions and services for many markets, including data communications, consumer electronics, industrial, automotive, commercial vehicle and medical.
Suggested Items
Real Time with... IPC APEX EXPO 2025: New Dispensing and Coating Solutions from Rehm
04/03/2025 | Real Time with...IPC APEX EXPOMichael Hanke, Global Sales Officer at Rehm, discusses new dispensing and coating equipment developed in Germany. He emphasizes the significance of software integration with customer systems to tackle market challenges.
BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges
04/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.
Real Time with... IPC APEX EXPO 2025: Nordson's Expansion of Intelligent Technologies
04/02/2025 | Real Time with...IPC APEX EXPOJonathia Ang-Mueller gives an update on Nordson's latest selective soldering system which features a small footprint, offering cost savings and increased production capacity. Advanced software allows for pre-sales simulations, enhancing customer engagement.
Knocking Down the Bone Pile: Basics of Component Lead Tinning
04/02/2025 | Nash Bell -- Column: Knocking Down the Bone PileThe component lead tinning process serves several critical functions, including removing gold plating, mitigation of tin whiskers, reconditioning of component solderability issues, and alloy conversion from lead-free (Pb-free) to tin-lead or from tin-lead to lead-free for RoHS compliance. We will cover each of these topics in more detail in upcoming columns.
Real Time with... IPC APEX EXPO 2025: Innovations at Indium Corporation—A Look into the Future
04/02/2025 | Real Time with...IPC APEX EXPOIndium Corporation, led by CEO Ross Berntson, is making strides in automotive applications with innovative solder paste technologies. The company prioritizes sustainability and energy efficiency in manufacturing while developing its workforce through partnerships with local universities.