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Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

Rewriting Metallization, One Ink at a Time

06/09/2026 | Marcy LaRont, I-Connect007 Magazine
Additive manufacturing has long promised to reshape how electronics are built, but that promise has remained just out of reach for many in the PCB industry who are limited by materials, performance trade-offs, and real-world manufacturability. Electroninks aims to change that equation by rethinking metallization at the chemical level by developing metal-complex inks that challenge established approaches and open new possibilities for advanced packaging, interconnects, and beyond.

Meet Emerging Engineers Ahmon Brooks-Starks and Nicolas ‘Cole’ Gregory, Summit Interconnect

05/29/2026 | Michelle Te, I-Connect007
While attending the Newcomers Reception at APEX EXPO 2026, I visited with Ahmon Brooks-Starks and Nicolas “Cole” Gregory, two new members of the Global Electronics Association’s Emerging Engineer Program. You might be a bit surprised at their backgrounds, but (hint) having a foundation in science has translated well into their jobs at Summit Interconnect.

Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect

05/05/2026 | Michelle Te, I-Connect007
Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.

Meet Emerging Engineer Logan Bistodeau, IBM

04/09/2026 | Michelle Te, I-Connect007
When he was growing up, Logan Bistodeau was always interested in how heavy machinery worked, so it was natural that he earned a mechanical engineering degree at Iowa State University. He originally grew up near the Twin Cities in Minnesota, now works for IBM, and is in his first year of the Emerging Engineer Program through the Global Electronics Association. I got to know Logan a little better at APEX EXPO 2026.

From Classroom to Boardroom: One Year Yields a World of Perspective

03/15/2026 | Marcy LaRont, I-Connect007
Few college seniors can say their first plane ride took them straight into a global electronics boardroom. However, Emily Daley, a Michigan Technological University electrical engineering student, spent her senior year as the Student Board Member to the Global Electronics Association Board of Directors. She brought a fresh, student-centered perspective to the industry as she attended APEX EXPO, as well as board meetings in Taiwan and Lake Tahoe.
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