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Meet Diana Radovan, IPC’s Global Sustainability Policy and Advocacy Lead

01/17/2025 | Marcy LaRont, I-Connect007
Dr. Diana Radovan joined IPC in August 2024 as the advocacy lead for sustainability policy, a role that requires awareness of global policy activities. From the IPC Munich office, Diana has been busy working as a policy analyst with Dr. Kelly Scanlon, IPC lead sustainability strategist. In this interview, she shares her background, her role at IPC, and what she wants to accomplish for the benefit of our industry.

NAMICS Brings Innovative Thermoset Materials to PCB Fabrication

01/16/2025 | Andy Shaughnessy, Design007 Magazine
At PCB Carolina, Matt Lake and Ken Araujo of NAMICS Technologies spoke with Andy Shaughnessy about the introduction of an innovative thermoset material to PCB fabrication. This groundbreaking material, originally developed for the semiconductor packaging industry, addresses a longstanding demand for unreinforced thermoset films that enhance dielectric properties in PCB applications and allow for manufacturing the very finest of features, 0.002" and below.

Cicor Chosen as Key Manufacturing Partner For Advanced Military Aircraft Program

01/13/2025 | Cicor
Cicor Group has been nominated by a leading European aerospace & defence (A&D) integrator as a key supplier to a new program of highly advanced electronic devices used in fast-jet aircraft.

TopLine to Sponsor IMAPS Wire Bonding Workshop in San Diego

01/09/2025 | TopLine
TopLine Corporation will sponsor an Advanced Technical Workshop and Tabletop Exhibition on Wire Bonding February 3-4, 2025, in San Diego, California, hosted by The International Microelectronics Assembly and Packaging Society (IMAPS), it is announced today.

Martin Heinz Named New CEO of iTAC Software AG

01/08/2025 | iTAC Software AG
MES/MOM provider iTAC Software AG has a new CEO: Martin Heinz will take over the position of Chief Executive Officer (CEO) with effect from January 1, 2025.
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