Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
IPC Standards Committee Reports — Assembly and Joining, Product Assurance
November 22, 2016 | IPCEstimated reading time: 4 minutes
These standards committee reports from IPC’s 2016 Fall Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports.
Assembly and Joining
The 5-20 Product Assurance Committee reviewed the status of the projects in its scope and started planning for the meetings to be held at IPC APEX EXPO 2017.
The 5-21a Component mounting subcommittee met to discuss the update of the Guidelines for Printed Board Component Mounting. The new document, IPC-7070 will be created by combining parts of IPC-770, IPC-7351B, IPC-7093 and IPC-7095. The goal is to gather all the component information into one document to make it more user friendly.
The 5-21f Ball Grid Array Task Group continued its review of action items for IPC-7095D, Design and Assembly Process Implementation for BGAs. Particular focus at this meeting was spent on incorporating new information on column grid array (CGA) technology.
The 5-21g Flip Chip Mounting Task Group made the determination that it will go into full revision and not just an amendment for IPC-7094, Design and Assembly Process Implementation for Flip Chip and Die Size Components. A working draft IPC-7094A will be distributed to the task group before the end of 2016.
The 5-21h Bottom Termination Components Task Group reviewed a major overhaul proposed for the document for the A revision of IPC-7093, Design and Assembly Process Implementation for Bottom Termination SMT Components. These changes are being led by Matt Kelly with IBM and Udo Welzel with Bosch, who will present a polished working draft for task group review and comment in early 2017. Additionally, Matt Kelly was named vice-chair of the task group, replacing Vern Solberg, who stepped down from this role after years of service.
The 5-22a J-STD-001 Task Group reviewed comments on IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. This task group met to resolve comments on criteria common to both IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability for Electronic Assemblies. For the first time, the group also met at the same time with the Task Groups working on IPC-A-610, Acceptability for Electronic Assemblies and IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies to resolve differences between the three documents addressing the same criteria.
The 5-22ad Requirements for Military Systems Work Group continued a discussion on content to address hardware contracted by the U.S. Department of Defense and used in military systems. They previously discussed a separate addendum, however during this meeting, they took action to review the J-STD-001FS, Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies. They are considering a joint effort with that Task Group.
The 5-22as Task Group discussed review comments from the Final Industry Review of the addendum to 5-22as, Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies.
The 5-22f Task Group discussed comments to the document and prepared for a draft for Final Industry Review of the Handbook and Guide to Supplement J-STD-001.
The 5-22h Thermal Profiling Guide Task Group is preparing the ballot version of IPC-7530A, Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave), once all comments from the Final Draft for Industry Review have been resolved. The task group plans to ballot IPC-7530A by the end of October and to publish by APEX EXPO 2017. This will be the first revision since its publication in 2001.
The 5-22k Bottom Termination Components Test Methods Task Group reviewed comments from the working draft distribution of IPC-TM-650, Test Method 2.4.35, Dye and Pry Test Method. The task group approved the draft to go to the 7-11 Test Methods Subcommittee for comment. The group will also seek out companies and test labs to participate in a gage R&R for the test method.
Product Assurance
The 7-30 Product Assurance Committee reviewed the status of the projects in its scope and started planning for IPC APEX EXPO 2017.
The 7-31b IPC-A-610 Task Group reviewed comments on IPC-A-610, Acceptability for Electronic Assemblies. The Task Group met to resolve comments on criteria comment to both IPC-A-610, Acceptability for Electronic Assemblies, and IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies.
The 7-31f Task Group met to discuss the comments received during the draft for final industry review period for IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies.
The 7-31k Wire Harness Design Task Group and 7-31h IPC-HDBK-620 Handbook Task Group continued working IPC-HDBK-620, Handbook and Guide to Supplement IPC-A-620.
The 7-31j Task Group continued working on a revision to IPC-A-630, Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures.
The 7-31m Fiber Optic Cable Acceptability Task Group met to discuss final changes and to resolve comments for IPC-A-640, Acceptance Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies. The task group plans to ballot the draft standard by the end of the year, so it will be approved for publication before APEX EXPO 2017.
The 7-34 Repairability Subcommittee reviewed comments submitted to IPC-7711/21, Rework, Modification and Repair of Electronic Assemblies, during the draft for final industry review period.
Share on:
Suggested Items
Hunting for Clues: Feng Xue Solving Circuit Board 'Crimes' With AOI Standard
05/08/2025 | Linda Stepanich, IPCWhen residents in sleepy English villages needed a top-tier detective to solve a murder, they called on Belgian super-sleuth Hercule Poirot, author Agatha Christie’s fictional detective famous for using his “little grey cells” to solve crimes. In the same way, IPC standards development committees, when creating a standard to detect defects in circuit boards using Automated Optical Inspection (AOI), call on IPC A-Team, Hercule.
IPC Strengthens Global Focus with Promotion of Sanjay Huprikar to Chief Global Officer
05/08/2025 | IPCIPC, the global electronics association, announces the promotion of Sanjay Huprikar to chief global officer. This newly created position reflects the association’s forward-looking strategy and industry needs to strengthen the electronics supply chain.
Navigating Global Manufacturing in an Era of Uncertainty
05/07/2025 | Philip Stoten, ScoopThe EMS industry faces unprecedented challenges as global trade tensions rise and tariff announcements create market uncertainty. In an overview of IPC Europe’s podcast, MADE IN EUROPE, industry experts from GPV and Zollner examine how these developments impact our businesses and customers, and what strategies will prevail in this new landscape.
Nick Koop Launches IPC Flex Design Class
05/06/2025 | Andy Shaughnessy, Design007 MagazineNick Koop is director of flex technology for TTM Technologies, and he’s been a staple of IPC’s flex committees for decades. He’s also a longtime flex design instructor, and he’s about to debut a new IPC class, Flex and Rigid-Flex Design for Manufacturability, which will run May 12–21. In this interview, Nick tells us about this new class and what attendees can expect to learn.
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
05/06/2025 | Chris Mitchell -- Column: The Government CircuitThere is certainly no shortage of work to be done in the IPC Government Relations department, as the U.S. waged a tariff campaign on practically every industrial country in the world and several countries embarked on high-tech initiatives with a mix of approaches to the crucial foundations of electronics manufacturing. Indeed, the breadth and speed of U.S. President Donald Trump’s tariff campaign continues to be a serious challenge for our industry.