-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
KYZEN’s Dr. Mike to Present LED Reliability Assessments at the LED A.R.T. Symposium
November 22, 2016 | KyzenEstimated reading time: 1 minute
KYZEN will exhibit at the LED Assembly, Reliability & Testing (A.R.T.) Symposium, scheduled to take place November 29–December 1, 2016 at the Crown Plaza Midtown in Atlanta, Georgia. Dr. Mike Bixenman, CTO of KYZEN, will be presenting a technical paper co-authored by Mark McMeen from STI Electronics Inc., entitled, “LED Reliability Assessments as a Function of Clean and Not Cleaned Packages” on November 30 at 1:30 p.m.
LED die package factors of higher current density, color uniformity and process residues require an understanding of both assembly and materials to improve reliability of chip on board and flip chip structures. A single LED failure results in a luminaire fail. Residues present on LEDs subjected to high temperature and humidity can impact color intensity, corrosion, poor interfacial bond strengths, insufficient wetting of underfill, leakage currents, electrical noise and field failures.
Cleaning process residues has been reported to improve wire bonding quality, reduce color shifts and prevent electrochemical migration. The test board for this study has sensors placed under and at the peripheral of the die package. The DOE will test leakage currents on both cleaned and uncleaned devices. Inferences from the data findings, conclusions and process recommendations will be reported.
Dr. Bixenman has more than 20 years of experience in the design of electronic assembly cleaning materials and process integration. He was the chair of the 2008 IPC/SMTA Cleaning Symposium and is the current chair of the IPC Cleaning Handbook Task Group. Dr. Bixenman holds four earned degrees including a Doctorate in Business Administration.
Suggested Items
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
The Knowledge Base: A CM’s Perspective on Box Build Practices
04/30/2024 | Mike Konrad -- Column: The Knowledge BaseIn the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic system. This intricate procedure, encompassing the assembly of everything from PCBs to wire harnesses and mechanical enclosures, demands a high level of precision, efficiency, and innovation. As the electronics assembly industry expands and diversifies, understanding the best practices within box-build assembly has become paramount for manufacturers aiming to stay ahead in a competitive market.
Latest Test and Inspection Solutions from GOEPEL electronic at SMTconnect 2024
04/29/2024 | GOEPEL electronicGOEPEL electronic will be demonstrating automated test and inspection equipment at SMTconnect, taking place in Nuremberg from June 11 to 13, 2024.
Determining the Value-add of Box Build
04/24/2024 | Nolan Johnson, I-Connect007At a strategic level, adding box-building services makes sense for customer loyalty. But is it really that simple? Jon Schmitz, who manages customer engagement at RiverSide Integrated Solutions, talk about about what it really takes to be successful in offering EMS and final assembly services under the same company banner.
IMAPS & IPC to Host Onshoring Workshop
04/16/2024 | IPCThe International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host an Onshoring Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.