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Sat Nusapersada Chooses Siemens' Process Preparation Software to Boost NPI and SMT Line Efficiency

11/21/2024 | Siemens Digital Industries Software
Siemens Digital Industries Software announced that Sat Nusapersada, one of the largest Electronics Manufacturing Services (EMS) providers in Indonesia, has adopted its Process Preparation software to reduce its timescale for New Product Introduction (NPI) of printed circuit board assemblies and improve the efficiency of its Surface Mount Technology production lines by 23 percent.

NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability

11/21/2024 | JCN Newswire
NTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.

PI's New Expansion for Higher Electronics Manufacturing Capacities and Shorter Lead Times

11/20/2024 | PRNewswire
PI, the market and technology leader for high-precision motion control, positioning technology, and piezo applications, has completed the construction of additional electronics production space at its Rosenheim, Germany site.

Infineon, Quantinuum Partner to Accelerate Quantum Computing Towards Meaningful Real-world Applications

11/20/2024 | Infineon
Infineon Technologies AG, a global leader in semiconductor solutions, and Quantinuum, a global leader in integrated, full-stack quantum computing, today announced a strategic partnership to develop the future generation of ion traps.

ASMPT: Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production

11/20/2024 | ASMPT
The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components are integrated in a common housing. With its exceptional process stability and a placement accuracy of ±0.2 μm @ 3 σ, this innovative bonding system is ideally equipped for the communication technology of the future.
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