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Dymax Multi-Cure 9-20557 Conformal Coating Offers Protection Against Thermal Shock
November 28, 2016 | Dymax CorporationEstimated reading time: Less than a minute
Dymax Multi-Cure 9-20557 is designed for rapid conformal coating of printed circuit boards and other electronic assemblies. This MIL-I-46058C listed product is especially formulated to remain on the edges of difficult-to-wet components and sharp leads, while its low modulus allows it to excel in coating applications where thermal shock performance is critical.
Multi-Cure 9-20557, which is UL approved and meets the IPC –CC-830 standard, has been optimized for coating thicknesses between 51 mic [0.002 in] and 510 mic [0.020 in]. This medium-viscosity material, designed to enhance wetting of leads, is compatible with most types of spray equipment. It fluoresces vivid blue when exposed to UV light (365 nm) for easy inspection of the coating coverage. In addition, its secondary heat-cure feature allows the coating to cure with heat in applications where shadowed areas exist.
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Brent Fischthal - Koh YoungSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.