-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Electrolube Debuts New Thermal Interface and Resin Solutions at LED Expo India
November 29, 2016 | ElectrolubeEstimated reading time: 3 minutes

Electrolube, the established global manufacturer of electro-chemicals, will launch the newest encapsulation resin systems and thermal management materials for India’s LED manufacturers at this year’s LED Expo, held at the Pragati Maidan in New Delhi, from 2-4 December.
Electrolube’s new innovations meet the ever increasing demands of the rapidly growing LED market, to fully maximise LED performance and lifetime, and ensure the desired results for heat dissipation are achieved. New products on show will include ER2224, which provides high thermal conductivity and excellent thermal cycling performance, making it ideal for use in LED lighting units where it helps to promote heat dissipation and prolong unit service life. The thermally conductive epoxy resin system offers an improved method of cure and subsequent health and safety benefits for the user.
The tough new UR5638 polyurethane resin provides a clear, transparent finish and is a low exotherm resin, making it ideal for LED applications involving the encapsulation of larger LED lighting units. As an aliphatic polymer, the resin also offers superior UV stability as well as excellent transmission of visible light, making it an excellent resin for white light LEDs.
UR5639 has been designed to encapsulate a variety of electrical components, but is particularly suited to LEDs. UR5639 is a clear/transparent polyurethane resin featuring low exotherm, low viscosity, low hardness and high flexibility. The level of flexibility achieved by the cured resin means that the connecting legs of components are not placed under high levels of stress during the cure.
Electrolube will also launch two new silicone-free thermally conductive phase change materials. TPM350 provides low thermal resistance, excellent reliability and is exceptionally easy to apply. The material is similar to grease but without the mess and pump-out and is also dry to the touch, which is particularly useful for pre-apply applications. The TPM550 material features high thermal conductivity of 5.5 W/m.K and becomes workable at approximately 45°C. Its advanced formulation ensures minimal contact thermal resistance and TPM550 also produces no mess due to its thixotropic characteristics, which prevent flow outside of defined interfaces.
Designed for use between heat generating components and heat sinks, the highly flexible GP300S and GP500S Thermal Gap Pads provide excellent thermal conductivity with a wide operating temperature range from -50 to +160. Both gap pads are ideal for applications where rapid and efficient heat removal is required and can be cut to any size. GP300S provides thermal conductivity at 3.00 and GP500S provides higher thermal conductivity at 5.00.
Ron Jakeman, Managing Director of Electrolube, comments, “We are delighted to return to the Led Expo. In previous years, Electrolube has been actively sought out at the show to help local manufacturers find thermal solutions for their requirements. Since setting up our sales facility in India 4 years ago and more recently opening our state-of-the-art manufacturing facility in Bangalore, Electrolube is fast becoming the first point of contact for thermal interface solutions in India. It is a very dynamic time for us and indeed for materials innovation in the LED market. Having a direct presence in the country is enabling us to have immediate contact with the market and provide first rate technical support to critical market sectors. With LED applications becoming more diverse and challenging, we are looking forward to the responses from visitors to our new LED protection solutions, which uniquely combine the desired aesthetic affect with the practical capacity to extend reliability and lifetime of the LED product.”
Visitors are welcome to meet Electrolube’s experts on stands K95 and K105 at LED Expo for advice about their applications and suitable product selection.
About Electrolube
Electrolube, a division of H.K. Wentworth Limited, is a leading manufacturer of specialist chemicals for electronics, automotive and industrial manufacturing. Core product groups include conformal coatings, contact lubricants, thermal management materials, cleaning solutions, encapsulation resins and maintenance and service aids.
The extensive range of electro-chemicals at Electrolube enables the company to offer a ‘complete solution’ to leading manufacturers of electronic, industrial and domestic devices, at all levels of the production process. Through collaboration and research, the company is continually developing new and environmentally friendly products for customers around the world and their commitment to developing ‘greener’ products has been endorsed by the ISO 14001 standard for the highly efficient Environmental Management System in place at the company.
Electrolube is represented in over 55 countries with an established network of subsidiaries and distributors. By offering genuine security of scale and a reliable supply chain, the company is able to deliver a truly tailored service.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
Marcy’s Musings: Advancing the Advanced Materials Discussion
09/17/2025 | Marcy LaRont -- Column: Marcy's MusingsAs the industry’s most trusted global source of original content about the electronics supply chain, we continually ask you about your concerns, what you care about, and what you most want to learn about. Your responses are insightful and valuable. Thank you for caring enough to provide useful feedback and engage in dialogue.
September 2025 PCB007 Magazine: The Future of Advanced Materials
09/16/2025 | I-Connect007 Editorial TeamMoore’s Law is no more, and the advanced material solutions being developed to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.