-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Metcal Announces Global Launch of Solder Wire Feeder System
December 1, 2016 | MetcalEstimated reading time: 1 minute

Metcal has announced the global launch of its Solder Wire Feeder System, which speeds up the soldering process and increases efficiency by adding control and convenience to the line.
The Solder Wire Feeder pairs with Metcal's SmartHeat MX-5200 or MX-500 Soldering and Rework Systems. The digital controls, along with the system's high performance and ability to handle multiple diameters, provides repeatability and functionality.
The digital controls feature multiple modes of operation, including forward feed, retraction, delay and speed, all programmable parameters in either the automatic, forward, or the backward mode of operation. Additionally, the large LCD screen displays program parameters and a cycle counter with the selectable unit of measure, millimetres or inches.
With internal program storage, the Solder Wire Feeder stores 30 programs, allowing the operator to select the right program for each application. Password protection prevents unintended changes to stored programs, and multiple solder diameters make the system compatible with solder diameters from 0.3mm to 1.27mm.
About Metcal
Since 1982, Metcal has been a recognized worldwide leader in the electronics assembly marketplace. Metcal has an industry-leading position providing advanced technology products in conduction soldering, rework/repair, fume extraction and fluid dispensing arenas. Metcal product line includes hand soldering and desoldering, convection rework, advanced package rework, fume extraction and fluid dispensing products. Metcal products continue to set the standard for performance, reliability, flexibility and cost-effective performance and are available from authorized distributors in North America and around the world. For more information, click here.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.