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LA/OC SMTA Chapter Dinner Meeting to Highlight Cleaning's Re-Evolution
December 5, 2016 | Aqueous TechnologiesEstimated reading time: 1 minute
The Los Angeles/Orange County (LA/OC) Chapter of the Surface Mount Technology Association (SMTA) will be holding its chapter dinner meeting on April 20, 2017, and will feature a presentation titled "Cleaning's Re-Evolution", to be discussed by Mike Conrad, president of Aqueous Technologies.
This presentation will review common failure mechanisms associated with assembly residues including the three basic electrical chemical migration failure models (dendritic growth, parasitic leakage, and CAF). Two case histories will also be presented.
- How a solvent-centric NASA contractor switched from a solvent cleaning process to an aqueous cleaning process. Test results from both processes were submitted to NASA with surprising results.
- How a contract manufacturer was sued by their customer for in-field product failures and how a $0.03 process could have saved millions.
This presentation will also review the future of the electronic assembly industry. The anticipated explosive growth of IOT, Industry 4.0, wearables, automotive ADAS systems, and other future connected devices promises to recharge the EMS industry.
The event will be held on JT Schmid's Restaurant & Brewery at 2610 E. Katella Avenue, Anaheim, California 92806.
For more information or to register, click here.
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Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect
05/05/2026 | Michelle Te, I-Connect007Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.
PCBAA, AAM Take on the Fight to Rebuild U.S. Manufacturing in New Documentary
05/05/2026 | Marcy LaRont, I-Connect007Throughout most of the 20th century, manufacturing was central to the American Dream of providing stable jobs and pathways to upward mobility. Today, more than 80% of global electronics manufacturing capacity resides in China and greater Asia, raising serious concerns about supply chain resilience and national security.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/01/2026 | Michelle Te, I-Connect007If it feels like the PCB industry is accelerating faster than ever, you’re not imagining it. From advanced materials driven by AI applications to renewed investment in domestic manufacturing—and the next generation stepping into critical roles—there’s a lot shifting at once. My selections for this week highlight where the pressure points are forming, and where the opportunities are emerging.