Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Integran Appoints Christian Koenen GmbH as Exclusive Distributor in Europe
December 6, 2016 | IntegranEstimated reading time: 1 minute
Integran (Canada) is pleased to announce that it has entered into an exclusivity agreement with Christian Koenen GmbH (Germany) to act as the exclusive distributor of Nanovate™ SMD Solder Stencil Foils in Europe.
“Integran is very pleased to have entered into this partnership with Christian Koenen GmbH, known for their high tech capabilities in laser-cut SMD and Semicon Stencils,” says Gino Palumbo, CEO of Integran Technologies Inc.
“We’ve seen some outstanding properties from Integran’s Nanovate™ materials, and they are certainly translating into stencil performance,” says Michael Zahn, industry veteran and Business Development Manager at Christian Koenen GmbH. “We strive to deliver the highest quality product to our customers and we search the world for the best materials to do so,” he says, adding that “we recognize the need for innovation to spread across the industry, so we will be distributing Nanovate™ foils throughout Europe.”
Christian Koenen GmbH – HighTech Stencils – is specialised in the manufacture of high-precision metal stencils for technical printing. The highest product quality is reflected in all processes.
In the fully air-conditioned manufacturing facilities, the company produces stencils for wafer, LTCC and SMD technology on eight state-of-the-art cutting lasers, including three LPKF MicroCut II. An extensive range of measuring and quality assurance technologies are available for product quality inspection. The company is ISO 9001-2000 certified.
Through technological innovations and state-of-the-art manufacturing techniques, the company has developed to the technologically leading stencil manufacturer within only a few years.
Christian Koenen GmbH also operates an in-house Application Center. It provides facilities for implementing process optimisations and printing tests based on customer parameters and materials. The achieved results are incorporated into the custom-designed stencils of the customers and represent the basis for stable and reproducible production processes
About Integran Technologies Inc.
Integran Technologies Inc. is a leading international supplier of nanotechnology-enabled metallurgical products and services. Operating under AS9100C/ISO9001 quality standards for the aerospace and defense sectors, Integran is already a leading supplier of fine-grained electroformed hard nickel foils to the North American market with a reputation for high quality manufacturing and customer service with fast (2-3 business day) turnaround.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.