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TRI to Feature All-around 3D Inspection at NEPCON Japan 2017
December 9, 2016 | TRIEstimated reading time: 1 minute
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry will join NEPCON JAPAN 2017 held at Tokyo Big Sight on January 18-20 featuring the most-complete one stop inspection solution for Industry 4.0-based PCBA manufacturing. Visit Electrotest 2017 booth E17-28 to see TRI's all new 3D SPI, 3D AOI, 3D CT AXI and ICT solutions in action and discuss your quality issues with TRI's experts.
TRI's VP of Sales and Marketing Jim Lin encouraged NEPCON Japan visitors: "Looking forward to 2017, we have re-engineered our 3D inspection solutions to meet the next generation demands for faster, more accurate results and easier programming. We invite you to visit TRI during the show to discover how much further the leading test and 3D inspection solutions can take your production!"
Presenting an integrated solution for the PCBA production line, TRI will premiere the upgraded award winning SPI, AXI and ICT solutions along with our brand new 2D+3D AOI, TR7500QE at NEPCON Japan. Our expert staff will be ready to discuss the entire one-stop-solution for ensuring PCBA production quality in Industry 4.0 smart manufacturing environment.
About TRI
TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more click here.
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