-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current Issue
Power Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
IPC: Connected Factory Initiative Subcommittee's Progress on Machine Data Interface Standard
December 12, 2016 | IPCEstimated reading time: 2 minutes
Representatives of industry’s leading manufacturers, machine, device, sensor and software companies that comprise IPC’s 2-17 Connected Factory Initiative Subcommittee have made significant strides in developing a machine data interface standard, “Connected Factory Exchange or CFX” that would enable manufacturers, equipment, device and software suppliers to achieve Industry 4.0 benefits.
The subcommittee’s charter states that the standard will support the goal of true “plug and play interoperability” of devices, systems and machines in the factory. The standard would provide for a “baseline required” transport mechanism to support plug-and-play, but also allow for optional transport methods. However, to achieve the goal of plug and play interoperability when one purchases a machine or system compliant with the standard, a baseline transport would be necessary.
The subcommittee formed a task group that created the “Machine Communications Functional Requirements” survey to gather feedback from equipment, device, software, and product manufacturers and suppliers on the data sets and functional capabilities CFX should support. Survey data was reviewed by task group leaders, Dan Gamota, director of hardware innovation group at Jabil Circuit and Ranjan Chatterjee, vice president, emerging business and technology office at Cimetrix Inc. The survey responses are being used to prepare the draft standard that will reflect the necessary functionality to fulfill the consensus based requirements to realize Industry 4.0 benefits.
“2-17 Subcomittee Co-chair Mahi Duggirala and director of enterprise solutions at Flex offered to share the data integration work Flex is doing with their ecosystem of equipment suppliers and system integrators,” said Jason Spera, 2-17 subcommittee co-chair and CEO of Aegis Software. “Through this work, the plurality of machine vendors in the industry have already worked to create machine data and control interfaces using open standards to easily integrate with OT/IT systems in support of Industry 4.0 for their equipment.”
Adds, Nancy Jaster, IPC staff liaison to the 2-17 subcommittee and manager, IPC design process, “Some of Flex’s equipment suppliers and partners are willing to present and share the data content and interfaces they developed in collaboration with Flex, with IPC and the 2-17 committee for peer review, to see if those formats, transport/communication and implementation can be used as a baseline foundation to speed up the standard creation.”
The subcommittee plans to have the baseline foundation established by IPC APEX EXPO in February 2017. For more information on the evolving standards and 2-17 subcommittee activities, contact David Bergman, IPC vice president of standards and training at DavidBergman@ipc.org or +1 847-597-2840.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,800 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
Better Sustainability Policies for Electronics
10/29/2025 | Diana Radovan, Global Electronics AssociationI joined the Global Electronics Association in August 2025 as the director of sustainability policy. Since then, much has happened in terms of geopolitics and in the development and re-envisioning of sustainability policies in the industry. While the European Commission has released several legislative packages to simplify sustainability requirements (“omnibus”), these developments haven’t yet settled and are not in effect. Given the many recent and ongoing public consultations, with often conflicting input from a broad range of stakeholders, final negotiations remain rather polarized among policymakers.
SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
10/27/2025 | Marcy LaRont, I-Connect007Leaving the show floor on the final afternoon of SMTA International last week in Rosemont, Illinois, it was clear that the show remains a grounded, technically driven event that delivers a solid program, good networking, and an easy space to commune with industry colleagues and meet with customers.
Come Together: Tom Marktscheffel Used Data to Build CFX and a Global Factory Standard
10/27/2025 | Sandy Gentry, Community MagazineWhen Tom Marktscheffel, director of product management software solutions at ASMPT, looks back on his nearly three decades in electronics manufacturing, one word stands out: data. “Data is the new gold,” he says. Without it, automation, artificial intelligence, and the factory of the future are impossible. With it, the industry can move from manual, error-prone processes to smart, connected systems that make real-time decisions.