-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
SiSoft Discusses Signal Integrity Drivers and Challenges
December 14, 2016 | Andy Shaughnessy, PCBDesign007Estimated reading time: 7 minutes
KATZ: In the past, SI engineers became pretty good at exporting data to Excel or writing custom scripts to filter, sort and visualize their results. And, when it makes sense, we output CSV data directly to your spreadsheet of choice. But for many SI tasks that doesn’t make sense. So we’ve taken a two-pronged approach: First, allow customers to customize which data is saved and in what order, and second, incorporate advanced sort, filter, and roll-up capabilities directly within our tools. My view is that if you can imagine ways you’d like to visualize your data, then you should be able to make it happen. The tools should even challenge you to think about the data in new ways, and I think we’ve achieved that too. I really enjoy watching customers find new ways to plot and visualize data because that’s when important discoveries and breakthroughs are made. Of course, it’s great to see them performing more efficiently in their routine tasks too. And because a picture is worth a thousand words, we’ve created a series of on-line videos so customers can see how this (and our other new features) works. A video is worth a billion words, and so is data visualization and trend analysis done right.
SHAUGHNESSY: Tabbed routing is another issue we hear a lot about from engineers working with DDR designs. Why has tabbed routing been so tough to model, and how do you address that?
KATZ: That’s an interesting question, because our team took an alternative approach like we did with via modeling. In both situations, you might be inclined to think these structures require generalized 3D solutions. But, if you look closer you see fairly consistent structures getting designed and manufactured. We find that once we comprehend and model the relevant pieces of the structure we arrive at solutions that are orders of magnitude faster than conventional 3D solvers and correlate well with measurement. My team has actually published quite a bit in this space, including the paper, “Fast, efficient and accurate: via models that correlate to 20GHz,” and I view it as an arena where SiSoft really shines. Customers like the approach because analysis is fast enough to sweep through layout alternatives and derive the best solution for both signal performance and manufacturing. Our approach also enables large batches of post-route simulations to complete without a perceptible change when tabbed routing is used.
SHAUGHNESSY: What do you have coming up in the next few years or so?
KATZ: We have a lot of excitement over the future of our products. Enabling our customers to run more simulations smarter and faster with optimization and supporting advanced visualization and data mining techniques is key. SiSoft will continue to make significant investments in electromagnetic and algorithmic modeling as well as leverage our technology and expertise amongst our products. We see serial links moving towards speeds of 56Gbps with PAM4 modulation and detailed modeling of vias and crosstalk being critical to accurate analysis. We see statistical analysis becoming a requirement on both serial and parallel interfaces. One thing we will continue to do better than any of our competition is work closely and collaboratively with our customers and their suppliers to ensure we bring the capability they need for their next generation designs.
SHAUGHNESSY: I appreciate your time.
KATZ: Thank you, Andy.
References
- “New SI Techniques for Large System Performance Tuning,” by Donald Telian, SiGuys, and Michael Steinberger and Barry Katz, SiSoft, DesignCon 2016.
- “Understanding IBIS-AMI Simulations,” by Douglas Burns, John Madsen, Todd Westerhoff, and Walter Katz, SiSoft, DesignCon 2015.
Page 2 of 2
Suggested Items
Plasmatreat Expands its International Network and Opens a Subsidiary in Mexico
11/26/2024 | PlasmatreatOn-site sales, consulting, application engineering and service for local companies and global corporations based in Mexico: Plasmatreat GmbH has opened another branch in Querétaro, Mexico, to provide even better and more direct support to users and interested parties of atmospheric pressure plasma technology. Plasmatreat continues to expand its international network.
HANZA Wins New Customer in Germany
11/25/2024 | HANZAHANZA AB, listed on Nasdaq Stockholm, continues to secure new business, and has entered a manufacturing partnership with a leading German company specializing in advanced measurement equipment for mechanical components.
VORAGO Technologies, Collabora Partner to Advance Open Source in Space
11/25/2024 | GlobeNewswireVORAGO Technologies, a leading provider of radiation hardened and radiation tolerant MCUs and MPUs for Aerospace and Defense, and Collabora, a leader in open source software and support, announced they are partnering to advance the use of open source to achieve resilience for mission critical applications in space.
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
Sat Nusapersada Chooses Siemens' Process Preparation Software to Boost NPI and SMT Line Efficiency
11/21/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software announced that Sat Nusapersada, one of the largest Electronics Manufacturing Services (EMS) providers in Indonesia, has adopted its Process Preparation software to reduce its timescale for New Product Introduction (NPI) of printed circuit board assemblies and improve the efficiency of its Surface Mount Technology production lines by 23 percent.