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Trouble in your Tank: Are PCB Fabricators Ready for the Next Technology Curve?

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The electronics industry’s demand for smaller, faster, and more powerful devices is driving major advances in PCB manufacturing. One of the central priorities is to increase circuit density while maintaining performance and reliability. Manufacturers produce finer lines and spaces so more components can fit on smaller, more sophisticated boards. They are also refining SMT features to support tighter pitches without compromising performance.

Global Electronics Association Hosts IMPACT 2026 Session on Advanced Electronic Packaging System Integration, with Technical Perspectives from Unimicron, STATS ChipPAC and Wistron

10/22/2026 | Global Electronics Association
The Global Electronics Association hosted the session "Advancements in Component to System Integration" at IMPACT 2026, bringing together Unimicron, STATS ChipPAC, Wistron and market research firm TechSearch International.

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Rehm Thermal Systems Receives 2026 Mexico Technology Award for RDS UV LED

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Rehm Thermal Systems has been honored with a 2026 Mexico Technology Award for its innovative RDS UV LED curing system. The award was presented on October 7 in conjunction with SMTA Guadalajara.
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