Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Cobalt: The Next Conflict Mineral?
December 22, 2016 | IPCEstimated reading time: Less than a minute
Two recently launched initiatives to curb “the worst forms of child labor” and other abusive practices in the supply chain for cobalt, a key ingredient in lithium-ion batteries, are being led by electronics companies.
Apple, HP, Samsung SDI and Sony have joined an effort known as the Responsible Cobalt Initiative, while the Electronic Industry Citizenship Coalition (EICC), whose members include Apple, Dell, Foxconn, and Ford Motors, has announced the new “Responsible Raw Materials Initiative.”
The Responsible Cobalt Initiative is aiming to promote cooperation with the government of the Congo. Its members have pledged to follow Organization for Economic Cooperation and Development (OECD) guidelines for mining supply chains, which call for companies to trace how cobalt is being extracted, transported, manufactured and sold. Any abuses would require immediate correction. The initiative is being led by a Chinese business group, the Chinese Chamber of Commerce for Metals, Minerals and Chemicals Importers and Exporters, and supported by the OECD.
The EICC’s “Responsible Raw Materials Initiative” aims to expand scrutiny of its members’ supply chains beyond the “conflict” minerals— tin, tungsten, tantalum and gold.
IPC will continue to monitor the issue and will provide updates as they come in.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.