The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Beam On Technology Releases Web Application for Calculating Stencil Printability
December 29, 2016 | Beam On TechnologyEstimated reading time: 1 minute
Beam On Technology Corp. just unveiled a new web application that provides quick and easy calculations for predicting paste release and solder volume. The new web application is featured on Beam On Technology's website.
The Online Area Ratio Calculator is the only web app made specifically for solder paste stencil printing and now features more shapes than the mobile app. Simply input the dimensions of a specific aperture after the shape is selected and then select the foil thickness. Instantly, an algorithm displays the area ratio, with easy to understand color identifiers that infer solder paste transfer efficiency.
Beam On Technology's Area Ratio Calculator also provides supplemental data such as aspect ratio, solder paste volume in cubic mils, as well as suggested solder paste powder type. This web application features more shape selections, with even more aperture shapes to come, making it the more powerful version of the popular mobile app.
The Online Area Ratio Calculator is now available through Beam On Technology's website and works on all major web browsers.
The mobile version of the Area Ratio Calculator app by Beam On Technology is still free to download and available through the Apple Store or Google Play.
About Beam On Technology Corp.
Beam On Technology Corporation was established in October 1992, founded by manufacturing engineers with extensive knowledge and expertise in the assembly process. Our founding mission was to provide integrated service products to the SMT assembly industry engineered for ease of use that both increase yields and reduce defects. This continues to be our goal.
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.