-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Beam On Technology Releases Web Application for Calculating Stencil Printability
December 29, 2016 | Beam On TechnologyEstimated reading time: 1 minute
Beam On Technology Corp. just unveiled a new web application that provides quick and easy calculations for predicting paste release and solder volume. The new web application is featured on Beam On Technology's website.
The Online Area Ratio Calculator is the only web app made specifically for solder paste stencil printing and now features more shapes than the mobile app. Simply input the dimensions of a specific aperture after the shape is selected and then select the foil thickness. Instantly, an algorithm displays the area ratio, with easy to understand color identifiers that infer solder paste transfer efficiency.
Beam On Technology's Area Ratio Calculator also provides supplemental data such as aspect ratio, solder paste volume in cubic mils, as well as suggested solder paste powder type. This web application features more shape selections, with even more aperture shapes to come, making it the more powerful version of the popular mobile app.
The Online Area Ratio Calculator is now available through Beam On Technology's website and works on all major web browsers.
The mobile version of the Area Ratio Calculator app by Beam On Technology is still free to download and available through the Apple Store or Google Play.
About Beam On Technology Corp.
Beam On Technology Corporation was established in October 1992, founded by manufacturing engineers with extensive knowledge and expertise in the assembly process. Our founding mission was to provide integrated service products to the SMT assembly industry engineered for ease of use that both increase yields and reduce defects. This continues to be our goal.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.