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Top 10 Most-Read SMT News Stories of 2016
December 30, 2016 | I-Connect007Estimated reading time: 2 minutes
As the year comes to a close, the editors at I-Connect007 have pulled together a list of the top 10 news stories from the pages of SMT007. Enjoy this list of the most-read news highlights of 2016.
1. K-One Reports 53% Drop in 3Q Revenues
For the third quarter ended 30 September 2016, Malaysia-based EMS firm K-One Technology Berhad saw its revenue declined by 53% to RM19.4 million ($4.36 million) from RM41.6 million ($9.36 million) in the previous corresponding quarter, primarily impacted by the programmed shifting away from the mobile phone accessories’ business since the beginning of 2015.
2. I-Connect007's Coverage of IPC APEX EXPO 2016
If you didn’t make it to Las Vegas for IPC APEX EXPO 2016, don’t worry. I-Connect007 has complete coverage of this industry event at our RealTime with... show site.
3. Electrolube Appoints Alistair Little to Head Up Resins Division
Electrolube, the manufacturer of specialist chemicals for the electronics, automotive and industrial manufacturing industries, has announced the appointment of Alistair Little as Global Business / Technical Director for the Resins Division. He will take up his position at the beginning of January 2016.
4. NextFlex Names Founding Members
NextFlex, America's Flexible Hybrid Electronics Manufacturing Institute, today officially welcomed its founding members in conjunction with the 2016FLEX Conference and Exhibition in Monterey, California. During the event, which opens today, NextFlex will be convening meetings of its Governing and Technical Councils, as well as an intensive series of Technical Working Group sessions.
5. Indium Features Gold-Tin Solder Preforms for Precision Die-Attach Applications at AeroDef2016
Indium will feature its precision gold-tin (AuSn) solder preforms for die-attach at the upcoming AeroDef 2016 event in Long Beach, California. Designed for high-reliability applications, Indium's Pb-free and RoHS-compliant AuSn preforms are available in a variety of standard and custom-engineered designs.
6. IEC Launches New Website, Corporate Branding
IEC has launched its new website, designed to emphasize the company's unique manufacturing solutions for complex life-saving and mission critical products. In addition, the site reflects IEC's strategy to unify its operations under one cohesive brand, capitalizing on enhanced efficiencies to drive industry leading performance.
7. Plexus Posts $617M Revenue for 1Q FY 2016
Dean Foate, Chairman, President and CEO, commented, “Fiscal first quarter revenue and EPS results were largely in-line with our guidance. Consistent with the expectations we set last quarter, we are guiding our fiscal second quarter revenue sequentially flat at the midpoint of our guidance range, as new program ramps offset revenue lost from the two previously announced program disengagements."
8. IPC APEX EXPO 2016 to Feature Buzz Sessions on Latest Tech Trends
Tackling the hot topics that have the electronics industry “buzzing,” seven free Buzz sessions will be offered at IPC APEX EXPO, March 15-17 at the Las Vegas Convention Center. The industry’s top technical experts will provide information and insight on subjects ranging from conformal coating and lead-free solder alloys to R&D funding and a market outlook for the global electronics supply chain.
9. Benchmark Electronics Appoints Paul Tufano to Board
Benchmark Electronics has announced the appointment of Paul J. Tufano, who most recently served as Chief Financial Officer of the Alcatel-Lucent Group, as an independent director to the company's board of directors, effective immediately. Tufano will stand for re-election at the 2016 Annual Meeting of Shareholders.
10. Expert Assembly Launches New Quality Initiatives
Southern California EMS provider Expert Assembly Services recently enhanced that control with the addition of ultra-low RH component and PCB storage and drying by Super Dry.
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Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
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Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
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