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Indium to Discuss Low-Voiding Options at SMTA Rocky Mountain
January 4, 2017 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation will feature its void-reducing solder pastes at the SMTA Rocky Mountain Expo & Technical Conference on January 19 in Denver, Colorado.
Indium Corporation's Indium8.9HF and Indium10.1 solder pastes are designed to provide ultra-low voiding; offer great print capabilities for small and low profile components; are designed to overcome head-in-pillow (HIP); and have excellent shelf and stencil life.
"These industry-proven products satisfy a wide range of critical engineering requirements, as opposed to the single-purpose solutions you see on the market," said Pat Ryan, America's Sales Manager.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, click here.
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