Global Sourcing Spotlight: How Global Sourcing Drives Innovation
One World, One Industry: IPC APEX EXPO 2025 Marks a Special Anniversary Year
Nolan’s Notes: Your Golden Ticket
Seika Machinery to Exhibit at IPC APEX EXPO 2017
January 9, 2017 | Seika MachineryEstimated reading time: 2 minutes
Seika Machinery Inc. will exhibit in Booth #2409 at the 2017 IPC APEX EXPO, scheduled to take February 14-16, 2017 at the San Diego Convention Center in California. Seika will showcase a complete line up of leading-edge equipment, including the McDry HM-100BNF N2 Auto-Purge Model, Sawa Ecobrid SC-AH100 Fully Automatic Low-VOC Stencil Cleaner, Sayaka CT23NJ PCB Router, HIOKI FA1240 Flying Probe Tester, DEN-ON RD500V, UNITECH UC-250M-CV PCB Board Cleaner, MALCOM RCX Series and PCU-02V Spiral Viscometer.
The new McDry HM-1001BNF N2 Auto-Purge Model features an ultra-low humidity rapid dehumidication drying unit. With an RH level of just one percent, the system features automatic nitrogen purge upon opening/closing of doors. The ESD safe system also offers a power saving mode to reduce electricity costs.
The Sawa Ecobrid SC-AH100 Fully Automatic Low-VOC Stencil Cleaner provides a 66 percent reduction in CO2 emissions and energy consumption over the previously fully automatic cleaning system offered as well as a huge reduction in running costs. Additionally, the system cleans and dries in just ten minutes or less.
Sayaka CT23NJ PCB Router provides stress-free depanelization along with a fixture-based highly efficient dust vacuum system. In addition to clean and precise depanelization for densely populated PCBs, the router features advanced image-processing software with point-and-click operation for programming router paths.
The HIOKI FA1240 Flying Probe Tester provides a variety of benefits compared to conventional testing machinery. Some of these benefits include jig-less inspection for quick setup, and the proficient testing of mis-mounted components, faulty components, and poor contacts.
The DEN-ON RD500V series rework station is continually being upgraded to meet the latest electronics market needs and fast progress of technology. The RD-500V that will be presented at the show features all the latest enhancements including the new multiple step drives for profiling and process creation.
Seika also will highlight the UNITECH UC-250M-CV PCB Board Cleaner. The UC-250M-CV takes all the features of the UC-250M and adds a dual cleaning feature using a combination of a brush roller with the silicone/adhesive cleaning rollers. The combination dual dust removal system assures better results than a single brush or adhesive roller system.
The MALCOM RCX Series Modular Reflow Oven Profiling System offers complete profiling of reflow ovens, including oven temperature, video imaging, O2 concentration and convection air velocity. It verifies that ovens are performing at optimal conditions, and enables users to troubleshoot problem areas.
The MALCOM PCU-02V Spiral Viscometer is designed for expensive material testing and analysis by obtaining the viscosity characteristics with only a 0.2cc sample. MALCOM’s unique Spiral Sensor provides continuous measurement of non-newtonian fluids with good repeatability.
About Seika Machinery, Inc.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.
Share on:
Suggested Items
IPC Hall of Fame Spotlight Series: Highlighting Denny Fritz
03/13/2025 | Dan Feinberg, I-Connect007This month, the Hall of Fame spotlight features Denny Fritz, a long-time friend and associate of mine. Denny first got involved with IPC in 1978 while working with MacDermid. His first efforts were with the various board fabrication committees, something he believes helped lead to his eventual Hall of Fame award.
IPC Asia’s Talent Development Program Opens Pathways to a More Qualified Workforce
03/14/2025 | Evelyn Cui, IPC AsiaIn Asia, the contradiction between the rapid development of the electronics manufacturing industry and the shortage of talent is particularly evident. The existing talent pool cannot fully meet the market's demand for highly skilled professionals. According to feedback from industry companies, there is an urgent need for professionals with knowledge of IPC standards and practical skills in electronics. However, the reality is that most academic courses are disconnected from the actual needs of the industry, leading to disappointing results when companies recruit from universities and schools.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
IPC Releases Latest List of Standards and Revisions
03/12/2025 | IPCEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q1 2025.
The Test Connection Inc. Promotes Melanie Rutkauskas to Director of Operations for The Training Connection, LLC
03/11/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce the promotion of Melanie Rutkauskas to Director of Operations for The Training Connection, LLC (TTC-LLC). With her extensive background in operations management, accounting, and customer relations, Melanie brings a wealth of experience and leadership to her new role.