-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
APEX EXPO 2026 Preshow
This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Seika Machinery to Exhibit at IPC APEX EXPO 2017
January 9, 2017 | Seika MachineryEstimated reading time: 2 minutes
Seika Machinery Inc. will exhibit in Booth #2409 at the 2017 IPC APEX EXPO, scheduled to take February 14-16, 2017 at the San Diego Convention Center in California. Seika will showcase a complete line up of leading-edge equipment, including the McDry HM-100BNF N2 Auto-Purge Model, Sawa Ecobrid SC-AH100 Fully Automatic Low-VOC Stencil Cleaner, Sayaka CT23NJ PCB Router, HIOKI FA1240 Flying Probe Tester, DEN-ON RD500V, UNITECH UC-250M-CV PCB Board Cleaner, MALCOM RCX Series and PCU-02V Spiral Viscometer.
The new McDry HM-1001BNF N2 Auto-Purge Model features an ultra-low humidity rapid dehumidication drying unit. With an RH level of just one percent, the system features automatic nitrogen purge upon opening/closing of doors. The ESD safe system also offers a power saving mode to reduce electricity costs.
The Sawa Ecobrid SC-AH100 Fully Automatic Low-VOC Stencil Cleaner provides a 66 percent reduction in CO2 emissions and energy consumption over the previously fully automatic cleaning system offered as well as a huge reduction in running costs. Additionally, the system cleans and dries in just ten minutes or less.
Sayaka CT23NJ PCB Router provides stress-free depanelization along with a fixture-based highly efficient dust vacuum system. In addition to clean and precise depanelization for densely populated PCBs, the router features advanced image-processing software with point-and-click operation for programming router paths.
The HIOKI FA1240 Flying Probe Tester provides a variety of benefits compared to conventional testing machinery. Some of these benefits include jig-less inspection for quick setup, and the proficient testing of mis-mounted components, faulty components, and poor contacts.
The DEN-ON RD500V series rework station is continually being upgraded to meet the latest electronics market needs and fast progress of technology. The RD-500V that will be presented at the show features all the latest enhancements including the new multiple step drives for profiling and process creation.
Seika also will highlight the UNITECH UC-250M-CV PCB Board Cleaner. The UC-250M-CV takes all the features of the UC-250M and adds a dual cleaning feature using a combination of a brush roller with the silicone/adhesive cleaning rollers. The combination dual dust removal system assures better results than a single brush or adhesive roller system.
The MALCOM RCX Series Modular Reflow Oven Profiling System offers complete profiling of reflow ovens, including oven temperature, video imaging, O2 concentration and convection air velocity. It verifies that ovens are performing at optimal conditions, and enables users to troubleshoot problem areas.
The MALCOM PCU-02V Spiral Viscometer is designed for expensive material testing and analysis by obtaining the viscosity characteristics with only a 0.2cc sample. MALCOM’s unique Spiral Sensor provides continuous measurement of non-newtonian fluids with good repeatability.
About Seika Machinery, Inc.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
IPC CFX Demo Line Debuts in Korea at EMK 2026
04/10/2026 | Global Electronics AssociationAt Electronics Manufacturing Korea (EMK) x NEPCON Korea 2026, the Global Electronics Association, in collaboration with 13 companies, showcased the IPC CFX Demo Line (Connected Factory Exchange demonstration line), marking its debut in Korea.
IPC-7712 Development Advances at APEX EXPO: Committee Aligns on Scope, Structure, and Industry Priorities
04/10/2026 | Circuit Technology Center, Inc.Significant progress was made in developing the proposed standard IPC-7712, Component Safe Removal for Failure Analysis and Reclamation, during in-person meetings held at APEX EXPO, March 16 to 18.
2026 IPC Masters Competition China Wraps Up With Record Participation
04/07/2026 | Blair Yan, Global Electronics Association East AsiaThe three-day 2026 IPC Masters Competition concluded March 27 at productronica China in Shanghai, bringing together the largest and most highly skilled group of electronics assembly professionals in the event’s 16-year history. With 623 participants from 77 companies across China—up 30% from last year—the competition reflected a growing focus on the practical application of electronics manufacturing standards.
IPC Masters Competition China 2026 Unveils Winners, Empowering Advanced Talent Development in Electronics Manufacturing
04/01/2026 | Global Electronics AssociationOn March 25–27, the IPC Masters Competition China was held in Pudong, Shanghai. This year’s competition brought together 623 leading professionals in the electronics industry from 21 provinces and municipalities.
Global Electronics Association, MIMOS Berhad Sign MoU to Advance Malaysia’s Electronics and Semiconductor Ecosystem
03/31/2026 | Global Electronics AssociationThe Global Electronics Association and MIMOS Berhad recently signed a Memorandum of Understanding (MoU) to collaborate in strengthening Malaysia’s electronics and semiconductor ecosystem, with a focus on advanced electronic packaging (AEP), industry alignment, and global best practices.