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Scienscope to Demo Its X-ray Product Line at IPC APEX 2017
January 9, 2017 | Scienscope InternationalEstimated reading time: 1 minute
Scienscope International, a complete inspection solutions provider, will exhibit in Booth #1331 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in California. Company representatives will be available for live demonstrations of Scienscope’s various PCB X-ray inspection systems and X-ray Component Counter.
The X-ray automated component counters offer a fast, reliable solution for counting all standard SMT and TH components, including 7” to 15” reels, ESD bags, cut tape, storage tubes, JEDEC trays (including BGA counting and BGA ball counting). Extremely fast and accurate, the component counting machines are designed to increase productivity by reducing time spent using manual counters, and eliminating errors.
Scienscope offers a variety of cabinet style X-ray systems from the X-Scope 1800 to the X-Spection 6000. All offer the latest state-of-the-art technology including high resolution flat panel image detectors, and micro-focus X-ray source up to 130kV. The X-SPECTION 6000 is Scienscope’s most technologically advanced cabinet style X-ray inspection system and includes a programmable rotating work table. The X-SPECTION 6000 offers the ultimate in flexibility.
In addition to cabinet style X-ray systems, Scienscope offers several fully automated inline AXI systems. Inline AXI machines from Scienscope are fully automated but flexible enough to use in various production environments, offering the same ease of use user interface offered on the cabinet systems.
About Scienscope International
Scienscope was founded in 1994 to meet the growing need for reliable and affordable general-purpose optical and video inspection solutions for the electronics and PCB industries. The company began with basic stereo zoom microscopes used for SMT inspection and rework of circuit boards and electromechanical assemblies with a commitment to quality, value and support. Over the past 20 years, Scienscope has evolved to become a complete inspection solution provider, offering both offline and inline X-Ray systems, Video coordinate measurement systems, Video inspection systems, and microscopes to meet a wide variety of applications and manufacturing quality requirements.
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Rachael Temple - AlltematedSuggested Items
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.