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Alpha to Feature Die Attach, High Temp Dip Tinning Technologies at Internepcon Japan 2017
January 9, 2017 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions will feature its range of ALPHA Products for Die Attach, High Temp Dip Tinning technologies and Assembly Polymers at the 2017 Internepcon Japan show, which will be held in Tokyo from January 18–20, 2017.
The commercialization of new technology has proven to be a complex process. Silver sintering has attracted a lot of interest over the last decade and has shown the ability to fulfill the electronics device reliability requirements.
"Alpha Argomax silver sintering products are the only products on the market that can be used in different form factors like paste, films or even preforms. These technologies have been developed by Alpha, a part of the MacDermid Performance Solutions group of businesses, to allow a fast (350°C. The alloys have been engineered to retain a highly reflective solder surface with very minimal surface oxide layer formation after long hours of high heat exposure, as compared to the generic alloys such as SnCu0.7 and SnCu3 alloys. The superior wetting performance of this alloy along with reduced pot maintenance due to low dross rates help improve production yield," said Bernice Chung, Regional Product Manager for Alloys.
Alpha Assembly Polymers include products ranging from Alpha Staychip underfills, Alpha Staychip epoxy flux, Alpha Staychip low-temperature adhesives and other Alpha Staychip epoxy related materials.
"These products are for applications requiring reinforcement of assembled parts/components, low temperature bonding, UV bonding or Dual Curing bonding. Selecting optimally the right Assembly Polymer for your application is critical," said Jimmy Shu, Director of Marketing for the Asia Pacific Region.
To learn more about new Alpha products, please visit Alpha at Internepcon Japan - Hall East 8-22.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox® and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet® products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
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