Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Alpha to Feature Die Attach, High Temp Dip Tinning Technologies at Internepcon Japan 2017
January 9, 2017 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions will feature its range of ALPHA Products for Die Attach, High Temp Dip Tinning technologies and Assembly Polymers at the 2017 Internepcon Japan show, which will be held in Tokyo from January 18–20, 2017.
The commercialization of new technology has proven to be a complex process. Silver sintering has attracted a lot of interest over the last decade and has shown the ability to fulfill the electronics device reliability requirements.
"Alpha Argomax silver sintering products are the only products on the market that can be used in different form factors like paste, films or even preforms. These technologies have been developed by Alpha, a part of the MacDermid Performance Solutions group of businesses, to allow a fast (350°C. The alloys have been engineered to retain a highly reflective solder surface with very minimal surface oxide layer formation after long hours of high heat exposure, as compared to the generic alloys such as SnCu0.7 and SnCu3 alloys. The superior wetting performance of this alloy along with reduced pot maintenance due to low dross rates help improve production yield," said Bernice Chung, Regional Product Manager for Alloys.
Alpha Assembly Polymers include products ranging from Alpha Staychip underfills, Alpha Staychip epoxy flux, Alpha Staychip low-temperature adhesives and other Alpha Staychip epoxy related materials.
"These products are for applications requiring reinforcement of assembled parts/components, low temperature bonding, UV bonding or Dual Curing bonding. Selecting optimally the right Assembly Polymer for your application is critical," said Jimmy Shu, Director of Marketing for the Asia Pacific Region.
To learn more about new Alpha products, please visit Alpha at Internepcon Japan - Hall East 8-22.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox® and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet® products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.