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Lincoln International EMS Stock Index for Q4 2016 Outperforms S&P
January 10, 2017 | Lincoln InternationalEstimated reading time: Less than a minute
Lincoln International’s EMS Stock Index has outperformed the S&P in the fourth quarter of 2016. The Large Index (Tier 1) has increased by 8.5% from the previous quarter, while the Mid Index (Tier 2) has increased by 17.4% from Q3. The Small Index, on the other hand, fell by 11.8%. Overall, the EMS Index went up by 10% on-quarter.
Leading the gainers are Sanmina (Tier 1), whose quarter-over-quarter share price performance went up by 28.7%; Kimball Electronics (Tier 2), which posted a 31.3% gain; and SMTC (Tier 3), which increased by 10.9%.
Worst performers include Flex (Tier 1), which dropped by 5.5%; Sparton (Tier 2), which fell by 9.2%; and IEC Electronics (Tier 3), whose quarter-over-quarter share price performance fell by 25.2%.
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Flexible Circuit Technologies to Host Free Flex Heater Webinar
08/18/2025 | Flexible Circuit TechnologiesGlobal Supplier of flexible circuits, flex design services, and assembly/box-build services, Flexible Circuit Technology will host their latest webinar, "Thermal Precision Meets Flexibility: The Technology Behind Heater Circuits" on Tuesday, August 26th, 2025 at 11 AM EDT.
A Passion for PCB Prototypes: Accurate Circuit Engineering—'Good People Doing Something They Love'
08/13/2025 | Linda Stepanich, Community MagazineFounded in 1983, Accurate Circuit Engineering (ACE) in Santa Ana, California, is a PCB prototype manufacturer and industry leader in radio frequency (RF) and microwave boards. It started as a family company and still adheres to those values by knowing its staff well and tailoring work and education to encourage them to stay at the company. “ACE is good people doing something they love,” says James Hofer, director of operations. “I am passionate about what I do, and ACE allows me to pursue that passion."
MKS’ Atotech to Participate in IPCA Electronics Expo 2025
08/11/2025 | AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands ESI® (laser systems) and Atotech® (process chemicals, equipment, software, and services) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 17th IPCA Show to be held at Pragati Maidan, New Delhi from August 21-23, 2025.
Flex Delivers Advanced Power Management for Next-Generation NVIDIA AI Infrastructure
08/07/2025 | FlexFlex announced a new power shelf system to fast-track 800 VDC power architectures and support the growing demands of AI infrastructure and AI factories.
Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
08/04/2025 | Michael Carano -- Column: Trouble in Your TankMetallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.