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Lincoln International EMS Stock Index for Q4 2016 Outperforms S&P
January 10, 2017 | Lincoln InternationalEstimated reading time: Less than a minute
Lincoln International’s EMS Stock Index has outperformed the S&P in the fourth quarter of 2016. The Large Index (Tier 1) has increased by 8.5% from the previous quarter, while the Mid Index (Tier 2) has increased by 17.4% from Q3. The Small Index, on the other hand, fell by 11.8%. Overall, the EMS Index went up by 10% on-quarter.
Leading the gainers are Sanmina (Tier 1), whose quarter-over-quarter share price performance went up by 28.7%; Kimball Electronics (Tier 2), which posted a 31.3% gain; and SMTC (Tier 3), which increased by 10.9%.
Worst performers include Flex (Tier 1), which dropped by 5.5%; Sparton (Tier 2), which fell by 9.2%; and IEC Electronics (Tier 3), whose quarter-over-quarter share price performance fell by 25.2%.
Suggested Items
Flexible Electronics Market to Reach $66.9 Billion by 2032, Growing at a CAGR of 9.2% from 2025
06/30/2025 | PRNewswireThe flexible electronics market is projected to reach $66.9 billion by 2032, up from an estimated $38.4 billion in 2025, growing at a robust CAGR of 9.2% during the forecast period.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
Gorilla Circuits Elevates PCB Precision with Schmoll’s Optiflex II Alignment System
06/23/2025 | Schmoll MaschinenGorilla Circuits, a leading PCB manufacturer based in Silicon Valley, has enhanced its production capabilities with the addition of Schmoll Maschinen’s Optiflex II Post-Etch Punch system—bringing a new level of precision to multilayer board fabrication.
All Flex Solutions Upgrades Lamination Layup
06/22/2025 | All Flex SolutionsAll Flex Solutions has invested in Ulrich Rotte lamination layup stations in their rigid flex layup area. The Ulrich Rotte stations automate the layup process by handling the lamination plates, which are heavy, and sequencing the layup process for the operators.
SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics
06/18/2025 | SEMIFlexTech, a SEMI Technology Community, today issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing.