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Indium Experts to Present at Pan Pacific Microelectronics Symposium 2017
January 10, 2017 | Indium CorporationEstimated reading time: 2 minutes
Indium Corporation’s Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Tim Jensen, Senior Product Manager for Engineered Solders Materials, will present at Pan Pacific Microelectronics Symposium 2017 (Pan Pac) in Kauai, Hawaii, which will be held on February 6-9, 2017.
Jensen’s presentation, Reinforced Solder Preforms for High Reliability and Low-Voiding, will detail evidence showing that a solder preform reinforced with a high-melting point metal can produce solder joints that are significantly more reliable than solder alone. He will also share results of testing that shows what impact, if any, reinforcing solder has on voiding levels.
Sandy-Smith will present Investigating Test Methods for Electrochemical Consistency in PCB Assembly Processes, which reviews traditional and emerging methods to characterize flux residues and cleanliness of finished assemblies, including surface insulation resistance (SIR), electrochemical migration, and other emerging test methods. Data will be shared showing how different methods can detect process variations in diverse ways, and then compare the results. She will also participate in an expert panel on the localized extraction followed by IC technique, commonly referred to as C3 testing.
Jensen is an SMTA-certified process engineer. He has more than 15 years of experience working with customers troubleshooting and optimizing SMT process lines and solving defects, such as head-in-pillow, graping, and QFN voiding. Jensen has worked directly on hundreds of surface mount lines and developed a number of different products. Using that direct knowledge and expertise, he works closely with Indium Corporation’s technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry. As senior product manager, Jensen is responsible for Indium Corporation’s most diverse product group, which includes solder preforms, wire, ribbon and foil, as well as thermal interface materials. He earned his bachelor’s degree in chemical engineering from Clarkson University and his master’s in business administration from Syracuse University.
Sandy-Smith specializes in printed circuit board assembly materials, particularly solder paste, and conducts application testing and qualifications for new product introductions. Sandy-Smith earned degrees in chemical engineering (with a focus on materials) and German language from the University of Rhode Island. She previously worked in R&D, developing conductive adhesives for die- and strap-attach, as well as conductive inks for RFID applications. Her areas of expertise include analytical testing of conductive materials, applications, such as screen-printing and jet dispensing (jetting), as well as scale-up and pre-production of developmental materials.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, click here or email abrown@indium.com.
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