-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Saki Exhibits Smart Factory 3D AOI and SPI Systems at IPC APEX
January 11, 2017 | Saki CorporationEstimated reading time: 2 minutes

Saki Corporation will exhibit its 3D automated optical inspection (AOI) and 3D solder paste inspection (SPI) systems and their Smart Factory and Industry 4.0 capabilities at IPC APEX 2017, San Diego, California, in booth 2909. Saki's inspection and measurement systems can be used to communicate with equipment in printed circuit board assembly lines to ensure that the PCBs are produced efficiently and adhere to the highest standards of quality and reliability.
Demonstrations of Saki's software suite will also be available. Saki's algorithm-based software provides extensive programming capabilities. It is intuitive to program and provides enough flexibility that, even if you're not a programmer, the operator can zoom in on the smallest area, see the component, solder, board, and/or defects from every angle, and examine exactly what needs to be seen. Offline programming emulates the machine, so programming and debugging can be done completely off line without having to rescan the board once the initial board image is captured. Changes to programs can be made on-the-fly, without having to stop the manufacturing or inspection process.
Saki's BF-3Di AOI system precisely inspects and measures the height of all devices on a printed circuit board and detects defects such as lifted leads, tombstones, reverses, and height variations at high speeds and cycle times. Saki's 3D BF-3Si SPI system is one of the world's fastest 2-projector solder paste inspection systems available. Its Phase Measurement Profilometry with Liquid Crystal on Silicon (LCoS) technology ensures high repeatability of inspection results.
"The Smart Factory is here now, and it's important that Saki is on the forefront of this initiative," said Satoshi Otake, general manager of SAKI America. "Our collaboration with Fuji, Panasonic, and other leaders in the industry are making it a reality. We hope visitors to IPC APEX will visit our booth to learn more about it."
IPC APEX is being held at the San Diego Convention Center, San Diego, CA, from February 14-16, 2017. Saki is exhibiting in booth 2909.
For more information contact Saki at +1.510.623.SAKI (7254), email sales.us@sakicorp.com, or visit our website.
About Saki Corporation
Since its inception in 1994, Saki has led the way in the development of automatic recognition through robotic vision technology, applying ground-breaking image processing tools to solve inspection problems associated with printed circuit board assembly. Saki Corporation has headquarters in Tokyo, Japan with offices and sales and support centers around the world. Saki has Quality Management System JIS Q 9001:2008 and ISO 9001:2008 certifications.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.