Stender: We are implementing the state-of-the-art closed loop automated pulse and DC plating system, as well as moving to insoluble anodes with the goal of drastically increasing plating uniformity. The insoluble anodes also mitigate the risk of copper metallic nodules therefore improving the overall quality of our plating process. This was identified as another opportunity to re-invest into the company and to improve the overall quality of products that we deliver to our customers.
Beaulieu: I know you are constantly investing in the company. Please give us the details.
Stender: Yes, this is something we are very proud of. Our focus is on automation and closed-loop systems. We have purchased new rectification systems, software tools to enable rapid expansion of knowledgeware, automated lamination systems/presses, and the current generation of LDI, AOI, test equipment, XRF, impedance testers, pinless lamination, planarization equipment, inkjet printers, robotic masking machines, as well as some other equipment all focused on production automation. In terms of the facilities, our upgrades include HVAC, more controlled environments, improvements to water systems. And finally, we are about to completely redo 100% of our wet processing area in Q1 of 2017.
Beaulieu: I know that you have worked on some exciting programs. Can you share some of those with me?
Stender: Certainly. This is something we are very proud of. We have worked on a number of mission-critical products including the F-35 Stealth fighter, the SM-6 defense missile interceptor, the B-52H bomber, and the PAC-3 missile interceptor, as well as the International Space Station. We are also working on exciting semiconductor projects using LCP. And the oil and gas markets continue to require extreme reliability, coupled with some major advances in performance that must work perfectly in an environment that is beyond extreme.
Beaulieu: How do you see the market today?
Stender: I am nervous about a couple of segments in this market. It seems that many defense programs are being pushed out more than expected; this is a very important market segment. I also believed that the merger of two large firms would create many new opportunities to bid on longer-term production programs. But we have yet to see these types of opportunities. Oil and gas is still a fraction of what it was a couple years ago; however, we are starting to see more development projects.
We believe the Internet of Things and automotive radar/sensors may give us some additional development opportunities. As I said earlier, we are in the business of being our customers’ partners from concept to reality. Which means that those companies that are building what I call products of the future—from products that are making the world safer and healthier to space exploration companies and medical companies—are all using cutting-edge and even bleeding-edge PCB technologies. And this is where C3 comes in. From our metal-backed and RF products, to our LCP products and our flex and rigid-flex products, we have positioned ourselves to be right there at the front edge of today’s highest printed circuit board technology. Our mission is to always be at the head of the pack of independent, easy-to-work-with PCB fabrication companies.
Beaulieu: Walt, thanks for talking with me today.
Stender: My pleasure.
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