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Matrix USA to Display New Hakuto 630NP Series Dry Film Laminator at IPC APEX 2017
January 16, 2017 | Matrix USA Inc.Estimated reading time: 1 minute
After only 14 months of active sales, Matrix has just delivered the ninth Hakuto 630NP Series dry film laminator to customers in the US. This is significant because customers are quickly accepting the new dry film lamination technology essential for success when imaging sub-5mil features. Panel yield on the new HSLL laminates with super low profile copper is now a priority.
Fred Long, Matrix Business Development says, “Our customers are reporting significantly improved yields on fine-line features. The new Mach 630NP laminator addresses the accuracy needed to assist in the direct image (DI) transfer of very fine lines on the latest laminates. This is made possible by the new lamination module with its even heat and even pressure across the entire surface of the laminated panel. In addition, the ability to change the rubber lamination rolls in seconds will not only increase productivity but will also offer alternative quick-change rubber solutions for different product needs. The complete redesign of the film lamination approach will now begin to reach the most important users of this latest technology. Matrix is eager to show manufacturers that by using the new system, Productivity and Yield will now surpass all traditional ROI expectations.”
A new full option Hakuto 6630NP dry film laminator will be on display at IPC APEX EXPO, San Diego, Feb 13-16, booth 3701.
About Matrix USA Inc.
Committed to the motto, “Quality Products, Dependable People,” Matrix was established in 1977 with the objective of providing quality raw materials to the North American Printed Circuit Board Industry. Matrix has four rapid-response warehouses located throughout the US and Canada that fulfill high quality, fast delivery, and custom orders daily. For further information, click here.
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RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
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Elephantech: For a Greener Tomorrow
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