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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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Matrix USA to Display New Hakuto 630NP Series Dry Film Laminator at IPC APEX 2017
January 16, 2017 | Matrix USA Inc.Estimated reading time: 1 minute
After only 14 months of active sales, Matrix has just delivered the ninth Hakuto 630NP Series dry film laminator to customers in the US. This is significant because customers are quickly accepting the new dry film lamination technology essential for success when imaging sub-5mil features. Panel yield on the new HSLL laminates with super low profile copper is now a priority.
Fred Long, Matrix Business Development says, “Our customers are reporting significantly improved yields on fine-line features. The new Mach 630NP laminator addresses the accuracy needed to assist in the direct image (DI) transfer of very fine lines on the latest laminates. This is made possible by the new lamination module with its even heat and even pressure across the entire surface of the laminated panel. In addition, the ability to change the rubber lamination rolls in seconds will not only increase productivity but will also offer alternative quick-change rubber solutions for different product needs. The complete redesign of the film lamination approach will now begin to reach the most important users of this latest technology. Matrix is eager to show manufacturers that by using the new system, Productivity and Yield will now surpass all traditional ROI expectations.”
A new full option Hakuto 6630NP dry film laminator will be on display at IPC APEX EXPO, San Diego, Feb 13-16, booth 3701.
About Matrix USA Inc.
Committed to the motto, “Quality Products, Dependable People,” Matrix was established in 1977 with the objective of providing quality raw materials to the North American Printed Circuit Board Industry. Matrix has four rapid-response warehouses located throughout the US and Canada that fulfill high quality, fast delivery, and custom orders daily. For further information, click here.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/18/2025 | Nolan Johnson, I-Connect007It may be the middle of the summer, but the news doesn’t quit, and there’s plenty to talk about this week, whether you’re talking technical or on a global scale. When I have to choose six items instead of my regular five, you know it’s good. I start by highlighting my interview with Martyn Gaudion on his latest book, share some concerning tariff news, follow that up with some promising (and not-so-promising) investments, and feature a paper from last January’s inaugural Pan-European Design Conference.
Elephantech Launches World’s Smallest-Class Copper Nanofiller
07/17/2025 | ElephantechJapanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.