Dan’s Biz Bookshelf: ‘Elevate: Push Beyond Your Limits'
The Marketing Minute: The First Step to More Sales—Marketing
It’s Only Common Sense: Customer Service Is Sales in Disguise
Global PCB & Laminate Industries Outlook 2017
January 16, 2017 | BPAEstimated reading time: Less than a minute
Most of the developed economies have seen a GDP growth between 1.2 and 2% during 2016 and 2017 is not forecast to show any improvements on these levels. In fact, there is a greater probability that averages will fall slightly. Of the developed leading nations, Japans GDP is set to fall below even this forecasted minimum with GDP growth likely to remain below 1% in 2017.
Commodity prices globally are strengthening and indeed there are price rises in the pipeline for copper – a key material for the electronics industry, of course. This will help to fuel the GDP of economies that rely on natural resources, many of which are emerging economies.
The Conference Board (based in the US) provide projections for the output growth of the world economy. Their figures would signpost Chinese GDP to grow by 3.8% in 2017, down slightly from 3.9% in 2016.
This prognosis is not at odds with the forecasts for the PCB industry which is illustrated in Figures 1 – 4 shown below. It too, reflects a period of muted growth for 2017. However, the charts ( Figures 1 – 4 are in value terms) do not factor in the proposed laminate price increases for 2017 whose levels have been influenced by the proposed rise in copper foil prices.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/18/2025 | Nolan Johnson, I-Connect007It may be the middle of the summer, but the news doesn’t quit, and there’s plenty to talk about this week, whether you’re talking technical or on a global scale. When I have to choose six items instead of my regular five, you know it’s good. I start by highlighting my interview with Martyn Gaudion on his latest book, share some concerning tariff news, follow that up with some promising (and not-so-promising) investments, and feature a paper from last January’s inaugural Pan-European Design Conference.
Elephantech Launches World’s Smallest-Class Copper Nanofiller
07/17/2025 | ElephantechJapanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.