-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Dr. Mike Bixenman Selected for Best of Conference Award for BTC/QFN Research Presented during SMTAI
January 17, 2017 | KyzenEstimated reading time: 1 minute
KYZEN is pleased to announce that one of Dr. Mike Bixenman’s papers that was presented during SMTA International 2016 has been selected by the SMTA for a Best Paper Award. Dr. Bixenman won the Rich Freiberger Best of Conference Award for his presentation entitled “BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes.” Bixenman co-authored the paper with Mark McMeen and Jason Tynes from STI Electronics.
The award is based on the conference attendees’ rating of each speaker at the technical session. As a veteran speaker at SMTA International, Dr. Bixenman makes contributions to the industry by sharing his research and findings.
It becomes necessary from time to time to change materials of construction, manufacturing processes, and process conditions. A soldering material or cleaning agent may become unavailable due to environmental regulation, market forces, or reformulation. Certain conditions require some form of verification and validation that the process meets the Original Equipment Manufacturers (OEMs) quality and reliability specifications.
J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies states that validation and verification be confirmed with test vehicles that are representative of the product being produced. Many of the industry standard test vehicles are dated and not representative of current electrical and electronic assemblies.
The purpose of this research is to use a non-standard test board with sensors placed at the bottom termination to study cleanliness and contamination effects under QFN components. The non-standard test board has features to also study thermal paddle design options and to develop a risk profile. This research will report Surface Insulation Resistance effects at the source of the residue.
Dr. Mike Bixenman, CTO of KYZEN, has more than 20 years of experience in the design of electronic assembly cleaning materials and process integration. He was the chair of the 2008 IPC/SMTA Cleaning Symposium and is the current chair of the IPC Cleaning Handbook Task Group. Dr. Bixenman holds four earned degrees including a Doctorate in Business Administration.
The authors will formally be presented their awards at the Opening Ceremony during SMTA International on Sept. 19, 2017 in Rosemont, Illinois. The papers are available in the conference proceedings available in the SMTA Bookstore.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Siemens Delivers New Solido IP Validation Suite
05/07/2024 | SiemensSiemens Digital Industries Software introduced Solido™ IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories and IP blocks.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/07/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs
05/07/2024 | Happy Holden -- Column: Happy’s Tech TalkA significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.