SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Standard of Excellence: Overcoming Service Failures—The Art of the Apology
Nolan’s Notes: Tariffs, Technologies, and Optimization
Rehm Presents Innovations at IPC APEX EXPO 2017
January 18, 2017 | Rehm Thermal SystemsEstimated reading time: 1 minute
Rehm Thermal Systems once again will be showcasing its latest innovations at the upcoming IPC APEX EXPO 2017 event, which will be held in San Diego, California from February 14-16, 2017. The company will present its latest plant technology for reliable reflow convection and condensation soldering at Booth 1901.
Rehm's new thermal system solutions to be exhibited are as follows:
VisionXP+ Vac: The 2-in-1 solution for reflow convection soldering
The VisionXP+ convection soldering system combines many further developments, in particular with regard to optimizing energy efficiency and reducing emissions. Customers can save up to 20 % energy in electronics manufacturing with this system, consuming an average of 10 tonnes less CO2 per year. The vacuum option makes condensation soldering processes possible with or without vacuum for the first time – all in one system! The VisionXP+ Vac reliably vacuums gas inclusions and voids during soldering while the solder is still in its ideal molten state. With a vacuum of up to 2 mbar, void rates of less than 2 % can be achieved.
ViCON: Simple system operation and optimum process traceability
Rehm presents the new ViCON software in the area of smart data and networking, featuring a touch-screen user interface. The German machine manufacturer has developed an innovative solution for easy operability and optimal traceability in the VisionX series. The software can, for example, monitor all values that have changed, or collect and statistically evaluate alarms in order to avoid errors and to optimize machine settings.
CondensoXC: top performance for best reflow condensation soldering
Reflow condensation soldering with the CondensoX series carries out the soldering process by means of hot steam and the Galden® medium. Large, heavy boards can be processed without a problem since the heat transfer is up to ten times higher than with convection soldering. The use of the injection principle and the control of temperature and pressure ensure accurate and diverse reflow profiling. Rehm presents the new CondensoXC at the trade fair. The plant is a particularly space-efficient, high-performance system in the CondensoX series and ideal for laboratory applications, small batch production or prototyping. Void-free soldering can be easily implemented in all systems of the series with the vacuum option.
Our Rehm team will be happy to offer you any advice! More information is also available online at www.rehm-group.com and www.ipcapexexpo.org.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.
SASinno Americas Introduces the Ultra Series
10/07/2025 | SASinno AmericasSASinno Americas has introduced the new Ultra Series, the latest generation of offline selective soldering systems. Available in two models—the Ultra-i1 and Ultra-i2—the new series is designed to meet the needs of manufacturers running small to medium batch sizes, multiple product types, and frequent line changes, while maintaining exceptional precision and process control.
Elmotec by E-Tronix to Showcase SolderSmart® TOP Robotic Soldering at The Assembly Show 2025
10/06/2025 | ELMOTECE-tronix, a Stromberg Company, is pleased to announce its participation at The Assembly Show 2025 in Rosemont, IL, October 21st through 23rd. Exhibiting under Elmotec by E-Tronix, Booth #448, the team will highlight the SolderSmart® TOP robotic soldering system, featuring live demonstrations throughout the show.