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Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe

04/23/2026 | Pete Starkey, I-Connect007
Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.

ASML Reports €8.8B Net Sales and €2.8B Net Income in Q1 2026

04/22/2026 | ASML
ASML expects Q2 2026 total net sales between €8.4 billion and €9.0 billion, and a gross margin between 51% and 52%

ASMPT Wins JSD as New Distributor

04/21/2026 | ASMPT
With this cooperation, ASMPT is increasing its presence in one of the most dynamic electronics manufacturing regions of the country while improving the support options for its local customers.

Synopsys Solutions Support NASA's Artemis Program with Spacesuit Analysis and Communication System Development

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NASA selected Synopsys, Inc. and EMA to verify spacesuit compatibility with the lunar environment.

Henger Targets AI PCB Challenges With Advanced Plasma Technology

04/02/2026 | I-Connect007 Editorial Team
Henger is pushing the boundaries of PCB manufacturing with its dynamic, next-generation plasma technology, purpose-built for the demands of AI-driven electronics. As designs move toward higher density, faster speeds, and advanced materials like M9 laminates, Henger’s innovative plasma systems deliver precise, uniform, and energy-efficient processing. In this interview, company leaders, Zhiquang Li and Ping Tang discuss how their cutting-edge solutions are redefining cleaning, surface activation, and process control—positioning plasma technology as a critical enabler of reliability and performance in the rapidly evolving AI hardware landscape.
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