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RoHS Exemptions Unlikely to Be Published Before Fall 2017
January 24, 2017 | IPCEstimated reading time: 1 minute
The EU Commission and Member States continue to meet to discuss the disposition of RoHS exemption renewal requests submitted by industry in January 2015. During their December 15, 2016 meeting in Brussels, the experts reviewed requests on: Lead as an alloying element in steel (Annex III exemption 6a); Lead as an alloying element in aluminum (Annex III exemption 6b); Lead as an alloying element in copper (Annex III exemption 6c); Lead in high melting temperature type solders (Annex III exemption 7a); Lead in a glass or ceramic other than dielectric ceramic in capacitors (Annex III exemption 7c-I), jointly with exemption request 2015-1; Lead as activator in the fluorescent powder (Annex III exemption 18b), jointly with exemption request 2015-3; Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors (Annex III exemption 24); and Lead in cermet-based trimmer potentiometer elements (Annex III exemption 34).
The Commission is currently working on preparing the draft legislative proposals for these and other exemptions) which will be sent to Member States for written consultation. The drafts will likely be published in the spring; final legislative acts could be published in the Official Journal of the EU (OJEU) in the fall at the earliest. Under the EU RoHS2, all existing exemptions were set to expire by July 21, 2016. However, all exemptions for which industry submitted a renewal application will not expire until the EU Commission completes the current ongoing review of the applications.
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.