-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
STI Electronics Sponsors Pan Pacific Microelectronics Symposium
January 27, 2017 | STI Electronics, Inc.Estimated reading time: 1 minute
STI Electronics Inc. has announced its sponsorship of the 2017 Pan Pacific Microelectronics Symposium. STI is a corporate sponsor for this year's event, which is scheduled to take place February 6-9, 2017 in Kauai, Hawaii.
STI Electronics has been a corporate member and supporter of the SMTA for more than 25 years. Many of its employees are active in the local chapters as well. An active IPC and SMTA member, STI President David Raby served two terms as president and two terms on the Board of Directors for SMTA.
The Pan Pac technical committee has finalized the program for the 2017 Pan Pacific Microelectronics Symposium at the Sheraton Poipu Kauai Resort. In addition to several inspiring keynotes, this program features ground-breaking research from global experts on advanced processes, design, embedding and Fan-Out packaging, interposer technology, materials, nanotechnology, quality, reliability, roadmaps and manufacturing strategies.
The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world. STI continually provides exceptional support of the SMTA and has sponsored numerous SMTA events over the years.
Utilizing some of the most advanced equipment for training, R&D, prototyping and analysis enables engineers and analysts at STI the versatility to provide the highest quality services for a wide range of products and services in order to address the challenges and issues facing today's electronic manufacturers.
About STI Electronics, Inc.
Since 1982, STI Electronics, Inc. (STI) has been the premier full service organization for training, consulting, laboratory analysis, prototyping, and small-to-medium volume contract PCB assembly in the electronics industry. STI also produces a complete line of solder training kits and training support products.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.