Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
ASC International to Exhibit at IPC APEX EXPO 2017
January 30, 2017 | ASC InternationalEstimated reading time: 1 minute
ASC International it will offer live demonstrations of its SPI and AOI solutions at the IPC APEX EXPO 2017, scheduled to take place February 14-16, 2017 at the San Diego Convention Center. ASC International will be in Booth 2727.
On display will be the VisionPro M500 offering low-cost, true 3D bench top SPI. The VisionPro HSi with increased inspection rates for 100 percent high-speed offline SPI and the VisionPro Fusion offers the industry's only true offline SPI /AOI combination package – all wrapped into a price point similar to single-technology platforms.
The VisionPro Series of SPI systems incorporates the most advanced, rapid 3D inspection technology coupled with an intuitive Windows 7 OS and packaged in a rugged, bench-top or stand alone platform. Utilizing the completely automatic measurement mode, errors associated with manual measurement subjectivity are eliminated, making the VisionPro M, AP and HSi series an exceptional value for electronics manufacturers concerned with improving quality and production yields.
The VisionPro Series of AOI systems incorporates the most advanced, 2D high resolution sensing technology coupled with an intuitive Windows 7 OS and packaged in a rugged, stand alone platform. Both image comparison and algorithm based defect detection software provides ease of programming with reliable, low false call rates to maximize performance.
About ASC International, Inc.
Since its foundation in 1992, ASC International has become a leading supplier of AOI and SPI systems and custom sensor technology integration. Headquartered in Medina, Minnesota, ASC International provides customers with the service and support needed to realize the value of their investment in inspection and process control systems. ASC International’s customers include world-class organizations like Celestica, Creation Technologies, Flex, Honeywell, Jabil, Lockheed Martin, Plexus, Rockwell Automation and Sanmina-SCI to name just a few.
Share on:
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.