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The Surface Mount Technology Association (SMTA) will hold the South East Asia Technical Conference on Electronics Assembly on March 28–30 at the Olive Tree Hotel in Penang, Malaysia. This highly technical three-day event is focused on today’s most important and timely issues.
The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges that our industry faces today. The event aims to be a platform for all the industry members to come together to share their knowledge and their vision for addressing these challenges.
Sessions and topics in this year’s program will focus on cleaning, conformal coating, assembly and test processes, design and manufacturing, advanced packaging, inspection and quality, Internet of Things (IoT), paste printing and soldering.
Keynote presentations include “When Coating Hits the Fan - Consequences of Poor Ruggedization,” by Jason Keeping, P.Eng., Celestica Inc.; “Recent Advances and New Trends in Semiconductor Packaging,” by John Lau, Ph.D., ASM Pacific Technology; and “IoE-Next Generation Supply Chain Ecosystems,” by Nasrudin Bin Abdul Muthalib, Cisco Systems (Malaysia) Sdn. Bhd.
Apart from the technical sessions, the SMTA Penang Chapter will also be celebrating its 10th year of building skills, sharing practical experience, and developing solutions in electronic assembly technologies.
For more information or to register, click here.
