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Global Electronics Association Releases Q4 Standards and Revisions Update

12/24/2025 | Global Electronics Association
Each quarter, the Global Electronics Association releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit electronics.org/ipc-standards. These are the latest releases for Q4 2025.

Connect the Dots: The Future of Designing for Reality—Outer Layer Imaging

12/24/2025 | Matt Stevenson -- Column: Connect the Dots
If you read my column regularly, you know I’m passionate about helping designers get the most from their designs. In my November column, I focused on designer best practices for the electroless copper component of the manufacturing process. The next step is outer layer imaging: the transition from digital to physical, and where the designer’s IP meets the board.

Accelerating Vehicle Electrification and Intelligence to Drive Automotive Semiconductor Market to Nearly $100B by 2029

12/18/2025 | TrendForce
TrendForce’s latest investigations indicate that the rapid acceleration of vehicle electrification and intelligence is expected to propel the global automotive semiconductor market from approximately US$67.7 billion in 2024 to nearly $96.9 billion by 2029, representing a CAGR of 7.4% over the 2024–2029 period.

Rethinking Soldering for Energy-efficient PCB Design

12/17/2025 | Daniele Perico, MacDermid Alpha Electronics Solutions
As automotive OEMs intensify their commitments to carbon neutrality, ranging from Stellantis’ 20381 net-zero target to BYD’s full value chain neutrality by 20452, they are also embracing circularity through material reuse, recycling, and closed-loop systems. This aligns with the sustainability challenges faced in electronics manufacturing, where energy-intensive processes contribute significantly to industrial CO₂ emissions. By integrating advanced materials and process innovations, both sectors are converging on a shared goal: reducing carbon footprints while enhancing reliability and operational efficiency.

Fresh PCB Concepts: Choosing Via Types—A Practical Guide for PCB Engineers 

12/18/2025 | Team NCAB -- Column: Fresh PCB Concepts
When you first learn PCB routing, vias look like plumbing: holes that let signals pass between layers. As designs become denser and products shrink, vias develop from simple interconnects into deliberate engineering choices. Selecting between through-hole, blind, buried, microvia, or advanced options like skip vias is a balancing act between electrical performance, manufacturability, cost, and long-term reliability. In HDI boards, via strategy is as consequential as the stackup, material selection, or component placement. 
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