-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Cohu Eclipse Platform Chosen for Testing Next Generation AI Computing Devices
September 19, 2025 | BUSINESS WIREEstimated reading time: Less than a minute
Cohu, Inc., a global supplier of equipment and services optimizing semiconductor manufacturing yield and productivity, announced its Eclipse platform has been selected by a leading U.S.based semiconductor manufacturer & foundry services company for production testing of next-generation processor devices. The Eclipse systems, equipped with Cohu’s proprietary T-Core Active Thermal Control (ATC) solution, optimizes yield through precise thermal management of high-performance computing processors: CPUs, GPUs, ASIC accelerators, network processors and other high-performance devices.
The Eclipse platform offers scalability across low to ultra-high-power applications providing unparalleled flexibility and efficiency. The T-Core thermal solution delivers up to 3kW power dissipation with ultra-fast temperature ramp rates and tight thermal guard band, ensuring optimal device temperature control and test repeatability. This flexibility reduces total cost of ownership and supports IDMs, Foundry and OSAT customer configurations.
“We are delighted to have been selected to support the testing of next-generation AI processors in extreme thermal environments, enabling growth of the ecosystem and customers’ roadmaps,” commented Luis Müller, Cohu President and CEO. “Our industry-leading thermal response and scalable platform architecture enable customers to accelerate time-to-yield while managing power and heat with precision.”
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Aismalibar North America Showcases Advanced Thermal Management Solutions at The Battery Show North America 2025
09/18/2025 | AismalibarAismalibar North America, a leader in high-performance thermal management solutions, will present its latest innovations at The Battery Show North America and Electric & Hybrid Vehicle Technology Expo 2025 in Detroit, Michigan, October 6–9, 2025, where attendees can meet the team at Booth #5929 to explore materials engineered for demanding EV and high-power electronics.
September 2025 PCB007 Magazine: The Future of Advanced Materials
09/16/2025 | I-Connect007 Editorial TeamMoore’s Law is no more, and the advanced material solutions being developed to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
The Road to Reliability: Why EV Electronics Matter More Than Ever
09/16/2025 | Stanton Rak, SF Rak CompanyThe global transition to e-Mobility is redefining the design and reliability expectations of automotive electronics. Unlike their internal combustion engine (ICE) counterparts, EVs operate under "always-on" conditions and are subject to higher voltages, higher currents, and elevated thermal loads. These systems also incorporate exponentially more sensors, control units, and advanced power electronics, often tightly packed in thermally constrained spaces.
Akrometrix Announces Next Generation Thermal Warpage Measurement Tool the PS600T
09/05/2025 | Akrometrix LLCAkrometrix, LLC, the leading provider of Thermal Warpage and Strain Metrology Equipment for semiconductor and electronics industries, recently announced the next generation in thermal warpage metrology with its PS600T system.
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.