-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on North America
A North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing.
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Empower Sets New Benchmark with 20x Faster Response and Breakthrough Sustainability Demonstrated at OCP Global Summit 2025
September 25, 2025 | Empower SemiconductorEstimated reading time: 1 minute
Empower Semiconductor, the world leader in powering AI-class processors, announced that its Crescendo chipset, an artificial intelligence (AI) and high-performance computing (HPC) processor true vertical power delivery platform, is available now for final sampling, with mass production slated for late 2025. With a combination of 20x faster transient response, 2x lower voltage droop and positioning under or near the processor, the Crescendo chipset enables gigawatt-hours (GWh) in energy savings for a typical AI data center. The breakthrough platform will be showcased at the 2025 OCP Global Summit, October 13–16 in San Jose, California.
With a patented architecture, the FinFast™-powered Crescendo chipset is a scalable, 3,000A+ vertical power delivery platform that integrates regulators, magnetics and capacitors in a single ultrathin package that delivers the industry’s fastest transient response—20x faster than traditional solutions—against steep AI and HPC compute power steps. With multi-megahertz (MHz) bandwidth and speed, Crescendo slashes power component sizes to provide 5x higher solution density and cuts power-delivery losses more than 20% by relocating the power conversion elements directly under or near the system-on-chip (SoC). An additional 15% reduction in xPU power and higher processor utilization is achieved for a typical AI workload, resulting in a significantly higher performance per watt metric, driven by Crescendo’s 2x lower voltage-droop response.
“We unveiled Crescendo at last year’s OCP and it immediately captured market attention for the unprecedented performance and energy savings it delivered,” said Tim Phillips, CEO, president and founder of Empower Semiconductor. “With customer designs now well underway, we are set for production by the end of 2025, bolstered by our recent $140M Series D financing that positions us to scale at speed.”
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
ViaSat-3 F3 Satellite Successfully Launches from Kennedy Space Center
05/04/2026 | BoeingBoeing mission controllers confirmed that the ViaSat-3 F3 (VS-3 F3) satellite is healthy in orbit following its successful launch aboard a SpaceX Falcon Heavy rocket at 10:13 a.m. ET from Kennedy Space Center (KSC) in Florida.
Microchip Expands Post-Quantum Root of Trust Controllers
04/29/2026 | MicrochipAs the industry embarks on the transition to post‑quantum cryptography (PQC), Microchip Technology is expanding its portfolio of Trust Shield, PQC‑ready devices with the TS1800 Platform Root of Trust controller and the TS50x secure boot controller.
Is China Plus One Still Happening in the PCB Industry?
04/28/2026 | Manfred Huschka, Manfred Huschka Management Consulting (Shenzhen) Ltd.For much of the past five years, China Plus One has been shorthand for supply-chain diversification: reducing dependency on mainland China by adding manufacturing capacity elsewhere in Asia. In the PCB industry, however, in early 2026, it is more nuanced. It looks less like a clean geographic shift and more like a layered, capital-intensive rebalancing of global capacity, one that still leaves China deeply embedded at the center.