Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Apex FA to Introduce Mirae MAI Odd Placement Machine at IPC APEX
February 3, 2017 | Apex Factory AutomationEstimated reading time: 1 minute
Apex Factory Automation will be introducing the new Mirae MAI machine to the North American Market at the IPC Expo February 14-16th in San Diego:
The Mirae MAI is a flexible hybrid machine which uses SMT Mounter technology to perform odd part insertion and placement. Its unique features include lead straightness inspection of thru hole parts before placement into the PCB via laser (preventing scrap parts and boards.) It also features a post placement component insertion verification using it’s unique ZHMD system. The MAI can feed bulk parts via vibratory bowl, or packaged parts in stick, SMT tape, and tray as well as both axial and radial tape and reel leaded components. Customized Gripper nozzles are available for all types of parts up 55mm tall, and the MAI can place standard SMT parts at high speed also.
Apex FA will also be exhibiting its award winning SJ Inno Tech HP-520SPI printer, the only SMT printer on the market that includes full PCB 3D SPI, giving feedback to the printer with zero time penalty, all in a single compact machine footprint. This award winning machine has received industry accolades by capturing both the Circuits Assembly NPI award and Global SMT Technology awards. Come see what all the buzz is about.
Also highlighted at the show will be the Xavis A-130 Xray system which will be presenting state-of-the-art 2D and MicroCT 3D Xray imaging. The new version of the VX3D class-leading 3D rendering/analysis software will also be demonstrated, showing the remarkable resolution and detail of Xray images only available with CT scanning technology.
For additional information stop by booth #2633 at the show or contact your local ApexFA sales representative.
About Apex Factory Automation:
Apex Factory Automation and their team of advanced surface mount technology experts deliver thoughtfully tailored and reliably supported manufacturing solutions to meet client requirements. Their highly scalable solutions include the comprehensive range of Mirae pick and place machines, SJ Inno Tech Printers , and XAVIS X-Ray systems. Apex FA team partners with its clients to establish best-value and optimized SMT production solutions for every manufacturing requirement – from low- to high-volume lines.
Share on:
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.