-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
AT&S Provides PCB Technology and System Integration Expertise to World’s Smallest Speaker
February 7, 2017 | AT&SEstimated reading time: 2 minutes

Graz-based start-up USound, in partnership with several Fraunhofer Institutes (IDMT, ISIT, IIS and IZM) and utilizing PCB technology together with system integration expertise from AT&S, has developed what is not only the world’s smallest speaker, but also the first based on micro-electro-mechanical systems (MEMS). The product is protected with numerous patents. MEMS are silicon chips or substrates with very small feature sizes, that have mechanical and electrical functions at the same time. They make it possible to implement extremely compact, reliable and energy-efficient solutions. With dimensions of just 5 mm x 7 mm x 2 mm, the micro-speaker has a frequency range of 2-15 kHz.
AT&S is a technology partner of USound. Development of the MEMS micro-speaker would not have been possible without innovations in materials, silicon integration and packaging. Thanks to state-of-the-art packaging solutions, the MEMS loudspeaker itself, its drive circuits (application-specific integrated circuits, ASIC) and passive elements can be integrated into a tiny component with an extremely small form factor.
To manufacture ultra-small components of this kind, innovative system integration is essential in addition to state-of-the-art printed circuit board (PCB) technology. Thus AT&S have developed not only optimised PCB technology, but also special process engineering solutions for component and semiconductor packaging – from embedding passive components to complete System-in-Boards (SiB) and System-in-Packages (SiP). A wide range of innovative products based on AT&S technologies are manufactured in large volumes, from miniaturised computer boards to medical sensor products and MEMS microphones – and now MEMS speakers too.
While MEMS components are widely used as acceleration and tilt sensors, and as microphones, in smartphones, wearables and vehicles, MEMS-based speakers did not exist until now. By eliminating the coil and magnet found in conventional solutions, MEMS speakers achieve extremely small dimensions along with low power consumption and very good sound quality.
USound will transfer the presented technology into mass production. The new generation of speakers based on semiconductor technology is set to come to market in 2018. They will require only half as much space and 80 percent less power than their predecessors. USound is also aiming to create better sound quality with its MEMS speakers than with conventional speakers.
About USound GmbH
USound GmbH is a fast growing audio start-up, founded with the mission of developing and producing the most advanced audio systems for mobile applications based on MEMS technology. The patented technological platform developed by USound is enabling the production of a new, revolutionary generation of MEMS micro speakers for wide-ranging mobile applications. USound is a fabless company: process R&D and manufacturing operations are outsourced to world class industrial partners. For more information, visit www.usound.com
Suggested Items
Microchip Enters into Partnership Agreement with Delta Electronics on Silicon Carbide Solutions
07/18/2025 | Globe NewswireThe growth of artificial intelligence (AI) and the electrification of everything are driving an ever-increasing demand for higher levels of power efficiency and reliability.
ViTrox’s HITS 5.0 Empowers Global Partners with Innovative Solutions and Stronger Bonds
07/16/2025 | ViTroxViTrox, strives to be the World’s Most Trusted Technology Company, proudly announces the successful conclusion of its fifth edition of High Impact Training for Sales (HITS 5.0), held from 23rd to 27th June 2025 at ViTrox Campus 2.0 and 3.0, located in Batu Kawan Industrial Park, Penang, Malaysia.
Global Citizenship: The Global Push for Digital Inclusion
07/16/2025 | Tom Yang -- Column: Global CitizenshipIt can be too easy to take the technology at our fingertips for granted: high-speed internet, cloud-based collaboration, and instant video calls across continents. Yet, for billions of people, access to these digital tools is a distant dream. As a global community, we must ensure that technology is available to all. Here is how technology is bridging physical, economic, and educational gaps in underserved regions and profoundly reshaping lives.
Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
07/10/2025 | MicrochipContinuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.