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Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
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February 7, 2017 | EIPCEstimated reading time: Less than a minute

- Call for Papers 25. FED-Konferenz, 21 & 22 September 2017
- Robots
- Tech Companies Should Do the Right Thing on Conflict Minerals
- Aerospace Supplier Quality System Certification (AS9100 Rev C) Audit Success at Ventec's UK Facility
- MicroTech 2017 IMAPS-UK Annual Conference “Advanced Packaging & Technology Trends”
- IFS2016 – Semiconductor Market Outlook & Forecast
- ICT Evening Seminar at the Best Western Plus Manor Hotel on March 14, 2017
- Solder Ball Elimination – In Wave, Selective & Reflow Soldering
- Ventec International Expands USA Manufacturing Capacity with Investment in New Equipment
- Affordable Bench-Top X-ray Inspection
- Atotech's sub 20µm universal final finish solution PallaBond at the IPC APEX Expo 2017
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Rachael Temple - AlltematedSuggested Items
Weller Tools Supports Future Talent with Exclusive Donation to SMTA Michigan Student Soldering Competition
07/23/2025 | Weller ToolsWeller Tools, the industry leader in hand soldering solutions, is proud to announce its support of the upcoming SMTA Michigan Expo & Tech Forum by donating a limited-edition 80th Anniversary Black Soldering Set to the event’s student soldering competition.
Koh Young Appoints Tom Hattori as President of Koh Young Japan
07/21/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, announced the appointment of Tom Hattori as President of Koh Young Japan (JKY).
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.