Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Zentech Manufacturing Adds Advanced Clean Room Capability
February 8, 2017 | Zentech ManufacturingEstimated reading time: 1 minute
Zentech Manufacturing Inc., in support of a major customer engagement in the Homeland Security market segment, is pleased to announce the addition of a sub-Class 5 cleanroom operating environment.
This facility addition, located in Zentech’s Baltimore location, will be utilized for final assembly processes of precision optics to support leading-edge biometric technologies for a wide range of government and commercial applications, as well as for mainstream Physical Identity Access Management (PIAM) applications.
Zentech is a premier electronics contract manufacturing company offering PCB (printed circuit board) design, SMT assembly, and PCBA testing services.
The cleanroom features Air Science Purair LF Hoods that are ISO 3, Federal Class 1 rated. ISO cleanroom classifications are rated by the amount of airborne particulate matter existing per cubic meter. Air Science Purair laminar flow cabinets are a series of high efficiency products designed to protect equipment and other contents of the work zone from particulates. At the heart of the cabinet product line is the specialized filtration technology that creates a clean work environment over a wide range of applications.
Zentech's two locations in Baltimore, MD and Fredericksburg, VA are ISO 9001 certified and contain equipment and controls to handle the latest printed circuit board assembly (PCBA) technology. Our equipment, systems and processes are optimized for flexibility in building complex products that have medium volume/high mix requirements.
We thrive when our customers thrive, so we make every effort to help ensure the success of our customers. Zentech is a turnkey operation and provides a high level of production/manufacturing engineering support.
Our certifications include ISO 9001, AS 9100, ISO 13485, DD2345, ITAR Certified, J-STD001 with Space and IPC Class 3 Trusted Source Validation Services Recognized.
For more information, click here.
Share on:
Suggested Items
EU Defence Electronics Ecosystem Highlighted in Brussels
07/01/2025 | I-Connect007 Editorial TeamIn this interview, Alison James, senior director of Global Electronics Association—Europe (formerly IPC), discusses the European Defence & Security Summit in Brussels, June 9–13, as well as the first IPC–ASD Europe Defense Electronics Summit, June 10th, which brought together 70 leaders from across the electronics manufacturing supply chain. ASD is the Aerospace, Security and Defence Industries Association of Europe, and co-hosted both the larger and smaller events.
Europlacer Expands U.S. Reach with New Eastern Region Representative
06/30/2025 | EuroplacerEuroplacer, a global leader in flexible SMT assembly solutions for High-Mix manufacturers, is pleased to announce the appointment of Photo Chemical Systems as its new representative for the Eastern United States.
PCBA Market to Reach $147.5 Billion by 2035, Growing at a CAGR of 4.7% from 2025
06/27/2025 | PRNewswireThe Printed Circuit Board Assembly market is projected to reach $147.5 billion by 2035, up from an estimated $90.91 billion in 2025, growing at a steady CAGR of 4.7% during the forecast period.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.