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BTU to Participate in ‘Making Reflow Ovens Smart’ Panel Session at IPC APEX EXPO 2017
February 10, 2017 | BTU International, Inc.Estimated reading time: 1 minute
BTU International Inc. is pleased to announce that Fred Dimock, Manager of Process Technology, will participate in a reflow panel during the IPC APEX EXPO. The panel session entitled, "Making Reflow Ovens Smart", is scheduled to take place Thursday, February 16, 2017 at 10 a.m.
Reflow ovens have become more sophisticated and dynamic in recent years, with capabilities to reduce voiding and optimization to reduce energy consumption and control the temperature flow to produce improved profiles and reliability. This panel will discuss the latest technologies affecting reflow ovens.
BTU is responsible for several recent advances that support Industry 4.0. These technologies include line control and communications, recipe development and energy savings software solutions.
Dimock holds an Associate’s Degree in Mechanical Design from Wentworth in Boston and a Bachelor’s Degree in Ceramic Engineering from the State University of New York at Alfred (SUNY). He is a long-standing member of the SMTA Technical Committee. Dimock's extensive experience in thermal processing includes positions at Corning, General Electric, and Osram-Sylvania before joining BTU.
About BTU International
BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment and processes to the electronics manufacturing and alternative energy markets. BTU equipment is used in the production of printed circuit board assemblies and semiconductor packaging as well as in the manufacturing of solar cells and nuclear fuel. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available here.
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Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.