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Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
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Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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Real Time with...IPC: BEST Talks Rework Challenges and Opportunities
February 16, 2017 | Real Time with...IPCEstimated reading time: Less than a minute

Bob Wettermann, president of BEST Inc., talks with I-Connect007's Stephen Las Marias about the challenges in rework, and how his company is helping their customers address these problems. He also discusses his paper presentation at this week's technical conference.
Suggested Items
APE, Automated Production Equipment, Marks 56-year Milestone
05/12/2025 | APEAutomated Production Equipment, or A.P.E. as the company has been known for more than a half century, is marking more than 50 years as a leading U.S. equipment supplier serving the printed circuit board assembly (PCBA) industry.
Real Time with... IPC APEX EXPO 2025: Technica's Innovations and Partnerships
04/11/2025 | Real Time with...IPC APEX EXPOJason Perry of Technica USA and Robert Beber of Reeco share about the engagement at their extra-large booth at this year's show, where they showcased 11 pieces of equipment and announced the new partnership for Technica with Reeco, supplier of ESD clothing and workbenches. With a positive industry outlook despite global trade uncertainties, Technica has plans to expand in North America.
BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges
04/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.
MacDermid Alpha Introduces Reworkable Edgebond for High-Reliability Electronics
02/06/2025 | MacDermid Alpha Electronics SolutionsIn an era where high-performance and sustainable manufacturing practices are crucial, MacDermid Alpha Electronics Solutions is redefining industry standards with the launch of ALPHA® HiTech® CF31-4026.
PDR Offers Advanced Infrared Heating Technology for BGA Rework
12/02/2024 | PDRPDR Americas is proud to highlight its industry-leading solutions for BGA and SMT rework. As a trusted partner in electronics manufacturing, PDR’s rework stations deliver precision, reliability, and simplicity, setting a new standard for addressing the challenges of modern rework applications.