The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Stadium Appoints Goran Sandstrom to Drive Growth of Design-led Technologies
February 21, 2017 | Stadium GroupEstimated reading time: 1 minute
Stadium Group has announced the appointment of Göran Sandström to the dual roles of Single Board Computing (SBC) Product Director and Wireless Sales Director, with immediate effect.
Stadium recently announced the acquisition of Cable Power Ltd., a leading provider of electronic, power and single board computing solutions, adding complementary supply chain products to the Group’s design-led offering. Last year, the Group opened a Regional Design Centre (RDC) in Kista Science City, Stockholm, to support its fast-growing wireless technologies business. Göran's appointment expands the team of high-caliber technical and commercial specialists based at the site.
Göran joins Stadium with over 23 years' experience in global technology industries including automotive, industrial, medical and telecommunications. His responsibilities within the group will extend across the power and wireless businesses; steering the product management and commercial development of key partnerships in the single board computing space and developing key wireless accounts.
His previous positions include Head of Embedded & Information Systems at Alten Sweden AB; Group Manager, XDIN AB/Stockholm; Strategic Account Director at Laird Technologies AB; and R&D Manager at Allgon Mobile Communications AB.
Charlie Peppiatt, CEO at Stadium Group, commented, "Göran is a great asset to our commercial team as we continue with the expansion of our design-led technologies business. With his long experience in technology-based industries, he will be a driving force in establishing key commercial partnerships that will deliver added value to our customers and contribute to the Group’s growth and future success."
Share on:
Suggested Items
SP Manufacturing Expands with New Malaysia Plant, Acquires Ideal Jacobs
12/26/2024 | PRNewswireSP Manufacturing (SPM), a leader in Electronic Manufacturing Services (EMS), is strengthening its global presence with two major moves: opening a new manufacturing facility in Senai, Malaysia, and successfully acquiring Ideal Jacobs Corporation.
Robosys, ACUA Ocean + OREC Secure Funding For Collaborative Autonomy Project
12/25/2024 | RobosysAdvanced maritime autonomy developer, Robosys Automation, supported by USV manufacturer, ACUA Ocean, and Offshore Renewable Energy Catapult (OREC), have jointly secured grant funding through Innovate UK.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.